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Vapor chamber and preparation method thereof

A technology of soaking plate and metal plate, used in lighting and heating equipment, welding equipment, manufacturing tools, etc., can solve the problem of not meeting the needs of heat dissipation or soaking

Pending Publication Date: 2020-01-03
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Millimeter-wave 5G mobile phones need to take into account the positional relationship between the modem, the processor CPU, and the antenna module. The traditional planar heat vapor chamber cannot meet the heat dissipation or heat equalization requirements of the above modules.

Method used

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  • Vapor chamber and preparation method thereof
  • Vapor chamber and preparation method thereof
  • Vapor chamber and preparation method thereof

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0045] The application discloses a vapor chamber, which has a three-dimensional structure.

[0046] Vapor chambers are usually arranged in electronic equipment for conducting heat in the electronic equipment.

[0047] In electronic equipment, such as mobile phones, the vapor chamber usually needs to soak the heat of the modem, processor CPU and antenna module in the electronic equipment. For 5G millimeter-wave mobile phones, the modem and processor are usually installed on one side...

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Abstract

The invention discloses a vapor chamber and a preparation method thereof. The vapor chamber adopts the three-dimensional structure. According to the scheme, due to wide application of 5G, positions ofmodulator-demodulators, processors and antenna modules of mobile phones, particularly mobile phones supporting millimeter waves are not designed on the same plane, thus, during heat dissipation or soaking of the modulator-demodulators, the processors and the antenna modules, traditional vapor chambers in planar shapes cannot meet the soaking or heat dissipation requirements of the modules which are not located on the same plane. The vapor chamber is designed to adopt the three-dimensional structure, so that the different positions of the vapor chamber adopting the three-dimensional structureare adjacent to the modules requiring soaking or heat dissipation respectively, and the vapor chamber adopting the three-dimensional structure can meet the heat dissipation or soaking requirements ofthe modulator-demodulators, the processors and the antenna modules simultaneously.

Description

technical field [0001] The present application relates to the field of vapor chambers, in particular to a vapor chamber and a preparation method thereof. Background technique [0002] Millimeter-wave 5G mobile phones need to take into account the positional relationship between the modem, processor CPU, and antenna module. The traditional planar vapor chamber cannot meet the heat dissipation or heat equalization requirements of the above-mentioned modules. Contents of the invention [0003] In view of this, the application provides a vapor chamber and a preparation method thereof, the specific scheme of which is as follows: [0004] A vapor chamber wherein, [0005] The vapor chamber is a three-dimensional structure. [0006] Further, the vapor chamber includes: [0007] plane part; [0008] A side wall portion, the side wall portion is formed by extending the edge of the plane portion away from the plane portion. [0009] Further, the vapor chamber includes: [0010...

Claims

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Application Information

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IPC IPC(8): F28D15/04B23K31/02
CPCB23K31/02F28D15/04
Inventor 喜圣华魏鑫
Owner LENOVO (BEIJING) CO LTD
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