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Ultrasonic water jetting device

An ultrasonic and water jetting technology, which is applied in the direction of spraying devices, spraying devices, liquid spraying devices, etc., can solve the problems of reduced cleaning power, difficult chip discharge, and weakened ultrasonic vibration of cleaning water.

Pending Publication Date: 2020-01-07
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, there is a problem that the ultrasonic vibration transmitted to the washing water is weakened, and the cleaning power is lowered.
[0008] In addition, in the technology described in Patent Document 3, when the depth of incision at the machining point is deep, it is difficult to discharge chips from the cutting groove.

Method used

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  • Ultrasonic water jetting device
  • Ultrasonic water jetting device
  • Ultrasonic water jetting device

Examples

Experimental program
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Embodiment Construction

[0022] First, the workpiece of this embodiment will be briefly described.

[0023] Such as figure 1 As shown, the wafer 1 as an example of the workpiece of this embodiment is formed in a disc shape, for example. On the front surface 2a of the wafer 1, a device region 5 including the device 4 and a peripheral remaining region 6 outside thereof are formed. In the device region 5 , the devices 4 are respectively formed in the regions divided by the grid-like dividing lines 3 . A peripheral remaining region 6 surrounds the device region 5 . In addition, a notch 9 indicating the crystal orientation of the wafer 1 is provided on the outer peripheral edge 7 of the wafer 1 . The back surface 2 b of the wafer 1 does not have the device 4 and is a surface to be ground which is ground by a grinding wheel or the like.

[0024] In this embodiment, after the back surface 2b is ground, the wafer 1 is subjected to spin cleaning using cleaning water. In addition, when cutting grooves are ...

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PUM

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Abstract

Provided is an ultrasonic water jetting device for cleaning a wafer without weakening the transmission of ultrasonic vibration. In the ultrasonic water jetting device (11), a radiation surface (26) that radiates ultrasonic vibrations toward washing water (L) in a water storage unit (19) is formed in a recessed dome shape. As a result, ultrasonic vibrations oscillated from the radiation surface (26) are concentrated toward the injection port (21). The ultrasonic vibration is not easily reflected in the water storage part (19), so that the ultrasonic vibration can be sufficiently transmitted through the ultrasonic water (Ls) jetted from the jetting port (21). Thus, when the wafer is cleaned using the ultrasonic water (Ls) jetted from the jetting port (21), ultrasonic vibration can be sufficiently transmitted to contaminants on the wafer, and thus the cleaning power can be improved.

Description

technical field [0001] The present invention relates to ultrasonic water jetting devices. Background technique [0002] The cleaning device cleans the wafer by powerfully spraying cleaning water from the cleaning nozzle to the wafer. In the techniques described in Patent Documents 1 and 2, in order to increase cleaning power, ultrasonic vibrations are transmitted to cleaning water, and the ultrasonic vibrations are transmitted to contaminants to remove the contaminants from the wafer. In addition, in the technique described in Patent Document 3, cutting chips are discharged by spraying washing water to the machining point. [0003] The cleaning nozzles described in Patent Documents 1 and 2 include, for example, a supply port for receiving supply of cleaning water, a water storage portion, a spray port, and a flat-plate-shaped ultrasonic vibrator. The water storage unit has a volume for temporarily storing the washing water supplied from the supply port. The water storage ...

Claims

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Application Information

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IPC IPC(8): B08B3/02B08B13/00H01L21/67
CPCB08B3/02B08B13/00H01L21/67051B08B2203/0288B05B17/06B08B3/12B05B1/02
Inventor 邱晓明
Owner DISCO CORP