Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PCB washing pool

A technology for printed circuit boards and circuit boards, applied in chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve tin whisker control and poor soldering, difficult to reduce production costs, low washing efficiency, etc. problems, to achieve the effect of increasing cleaning efficiency, enhancing vibration and speeding up

Active Publication Date: 2020-01-07
SHENZHEN SANDEYING ELECTRONICS CO LTD
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to make up for the deficiencies of the existing technology, solve the problems of tin whisker control and poor soldering in the prior art, and at the same time, the washing efficiency is low and the water consumption is low in the production process of PCB printed circuit boards. large, difficult to reduce production costs, the present invention proposes a PCB printed circuit board washing pool

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB washing pool
  • PCB washing pool
  • PCB washing pool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0028] As an embodiment of the present invention, a main water pipe 16 is provided on one side of the pool 1, the main water pipe 16 runs through the side wall of the pool 1 and extends to the outside of the pool 1, and the end of the main water pipe 16 located outside the pool 1 communicates with the low-pressure water pipe 17 One end of the main water pipe 16 located in the pool 1 is connected with a group of nozzles 18, and the nozzles 18 are arranged horizontally and towards the middle of the pool 1; pure water is sprayed through the nozzles 18 to impact the rope 14, so that the circuit board 15 swings, further increasing The cleaning efficiency of the circuit board 15; after the circuit board 15 enters the pool 1 by the drive of the walking trolley 12, the circuit board 15 is cleaned by detergent. Nozzle 18 sprays out, and pure water impacts rope 14, and rope 14 drives circuit board 15 to swing back and forth in pool 1, and the pure water ejected simultaneously drives the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of PCB production, and particularly relates to a PCB washing pool. The PCB washing pool comprises a water pool. Washing liquid and purified water are contained in the water pool. A pair of rail troughs is arranged above the water pool. The portion, located above the water pool, of each rail trough is concaved downwards to form an arched structure. A running trolley is arranged in the rail troughs, and roll in the rail troughs through rubber rolling wheels. The rubber rolling wheels are driven by a hub motor arranged in the rubber rolling wheels, andthe hub motor is connected with a power source through a controller. A circuit board is fixed to the bottom of the running trolley through a set of ropes. According to the PCB washing pool, the running trolley moves in the direction close to the water pool, then the circuit board is driven by the ropes to move, due to the fact that the portions, located above the water pool, of the rail troughs are concaved downwards to form the arched structure, the circuit board enters the water pool in an oblique state, then the speed that the circuit board enters the water pool is increased, and the cleaning efficiency of the circuit board is increased.

Description

technical field [0001] The invention belongs to the technical field of PCB production, in particular to a PCB printed circuit board washing pool. Background technique [0002] In the prior art, silver-containing additives are added to the tin-melting potion to form a tin-silver alloy layer. The silver-containing purpose is to inhibit the growth of tin whiskers; compared with the pure tin layer, the tin-silver alloy layer has occasional shrinkage. The risk of tin affects the soldering ability, but the pure tin layer cannot inhibit the growth of tin whiskers. [0003] The problems of tin whisker control and poor soldering occur frequently in the solder tin products in the prior art. For the immersion tin products in the prior art, it is necessary to solve the problems of tin whisker suppression and poor soldering at the same time. It is necessary to suppress tin whiskers, reduce the risk of tin shrinkage, and improve the solderability of tin products. It has become an urgent ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/04B08B3/08B08B3/10B08B13/00
CPCB08B3/022B08B3/041B08B3/08B08B3/10B08B13/00
Inventor 张波周乾松张同庆
Owner SHENZHEN SANDEYING ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com