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Semi-closed satellite-borne chip heat dissipation device

A chip heat dissipation, semi-closed technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of unsuitable space environment, inconvenient installation, limited application range, etc., to improve stability, The effect of wide applicability and universal portability

Pending Publication Date: 2020-01-10
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cooling device can only be used for the chip in the organic case, and its scope of application is severely limited; the cooling device needs to fit the chip and the case body in multiple directions, which is not easy to install; moreover, the cooling device needs to rely on the surrounding air convection to take away the heat To achieve the purpose of heat dissipation, not suitable for space environment

Method used

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  • Semi-closed satellite-borne chip heat dissipation device
  • Semi-closed satellite-borne chip heat dissipation device
  • Semi-closed satellite-borne chip heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] like figure 1 As shown, a semi-enclosed on-board chip cooling device, the material of the cooling device is aluminum, including a box body 1 with an open top, and a protrusion 2 corresponding to the chip on the circuit board is provided at the bottom of the box body, the box body 1 The edge 3 of the top opening is attached to the circuit board to form a closed structure, and the upper surface of the protrusion 2 and the edge 3 are coated with heat-conducting silicone rubber. The thickness of the side wall 4 of the box body 1 is 3 mm, the height of the protrusion 2 is 6 mm, the depth of the box body 1 is the sum of the height of the protrusion 2 and the thickness of the chip on the circuit board, and the error is less than 0.5 mm.

[0031] When the chip is working, heat is generated. On the one hand, the heat is conducted to the box body 1 of the heat dissipation device through the protrusion 2 in contact with the chip, and on the other hand, it is conducted to the box b...

Embodiment 2

[0033] like figure 2 As shown, a semi-enclosed on-board chip cooling device, the material of the cooling device is aluminum, including a box body 1 with an open top, and the bottom of the box body is provided with three protrusions 2 corresponding to the chips on the circuit board. 1 The edge of the top opening is provided with an extension part 5 to be attached to the circuit board to form a closed structure, and the upper surface of the protrusion 2 and the extension part 5 are coated with heat-conducting silicone rubber. The thickness of the side wall 4 of the box body 1 is 4 mm, the height of the protrusion 2 is 6 mm, the depth of the box body 1 is the sum of the height of the protrusion 2 and the thickness of the chip on the circuit board, and the error is less than 0.5 mm.

[0034] When the chip is working, heat is generated. On the one hand, the heat is conducted to the box body 1 of the heat sink through the protrusion 2 in contact with the chip, and on the other hand...

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Abstract

The invention discloses a semi-closed satellite-borne chip heat dissipation device, which belongs to the field of spacecraft heat control and chip protection. The heat dissipation device is made of ametal material and comprises a box body with an opening in the top, a plurality of protrusions corresponding to chips on a circuit board are arranged at the bottom in the box body, and the edge of theopening in the top of the box body is attached to the circuit board to form a closed structure. The contact surface of the protrusion in the box body and the chip and the contact surface of the edgeof the box body and the circuit board are coated with heat-conducting glue, so that the heat transfer speed is increased. Heat generated during working of chip, heat is transferred to the heat dissipation device through the protrusions making contact with the chip and the edges making contact with the circuit board, the problem of local overheating of the chip on the circuit board is solved through large-area heat dissipation of the heat dissipation device, the temperature of the chip is efficiently reduced, the influence of charged particles in space on the chip can be prevented, and the operation reliability of the chip is improved.

Description

technical field [0001] The invention belongs to the field of space vehicle thermal control and chip protection, in particular to a semi-enclosed on-board chip cooling device. Background technique [0002] In recent years, the rapid development of micro-satellites, with the continuous growth of space high-speed data transmission, image processing, intelligent identification, inter-satellite information interaction and other application requirements, will make the information data between satellites, satellites and payloads will be inevitable. Explosive growth, the star mission computer is bound to expand to support the operation of multi-task real-time operating systems and application software, making it an integrated electronic information platform that not only has conventional star mission management capabilities, but also can process payload data. [0003] Therefore, there is an urgent need to improve the data processing capabilities of the micro-satellite integrated ele...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/367H01L23/373
CPCH01L23/3114H01L23/367H01L23/3736
Inventor 楼海君马志鹏金仲和
Owner ZHEJIANG UNIV