A forming method of copper/aluminum composite material with high interfacial bonding strength

A technology of interface bonding strength and aluminum composite materials, which is applied in metal rolling, metal processing equipment, auxiliary arrangements, etc., can solve problems such as low bonding strength and high interface bonding strength, achieve large interface friction and improve interface bonding strength , The effect of reducing the requirement of rolling mill capacity

Active Publication Date: 2021-04-13
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims at the problems of low interfacial bonding strength of the copper / aluminum composite material prepared by the existing method, and proposes to process the surface to be compounded of the copper plate and the aluminum plate to obtain a macroscopic rough and uneven surface to be compounded, and to use louvers to control the surface After cleaning and degreasing, the surface to be compounded is polished, so that the direction of the stripes formed by grinding is perpendicular to the rolling direction, and then the copper plate and the aluminum plate are stacked up and down or side by side, and the billets are assembled side by side, and then the copper / aluminum billets are assembled at room temperature. Single-pass cold-rolled pre-composite under low pressure to obtain copper / aluminum cold-rolled pre-composite material, and then heat the copper / aluminum cold-rolled pre-composite material at high temperature for a short time to make it reach the temperature required for subsequent hot-rolled final compounding, and at the same time During the heating process, the atoms at the composite interface of the copper / aluminum cold-rolled pre-composite material are interdiffused and form an appropriate amount of intermetallic compound layer, and then the single-pass hot-rolled final composite is rapidly carried out. Through reasonable matching of process parameters, low cost Preparation of high-performance copper / aluminum composites with high interfacial bonding strength

Method used

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  • A forming method of copper/aluminum composite material with high interfacial bonding strength
  • A forming method of copper/aluminum composite material with high interfacial bonding strength
  • A forming method of copper/aluminum composite material with high interfacial bonding strength

Examples

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Effect test

Embodiment 1

[0040] Preparation of T2 pure copper / 1060 pure aluminum composites with high interfacial bonding strength.

[0041] At room temperature, the annealed soft state T2 pure copper plate (thickness 5mm) and the annealed soft state 1060 pure aluminum plate (thickness 3mm) were cleaned with alcohol and surface treated by louver grinding. Composite surface; the surface-treated pure copper plate and pure aluminum plate are stacked up and down to obtain a copper / aluminum billet; then a single-pass pre-cold rolling is carried out under the conditions of a rolling speed of 0.08m / s and a reduction of 35%. Composite to obtain the copper / aluminum cold-rolled pre-composite material; then, in the air atmosphere and under the conditions of heating temperature 505 ° C and heating time 15 minutes, the copper / aluminum cold-rolled pre-composite material is heated at a high temperature and short time to make the copper / aluminum cold-rolled pre-composite material The composite interface atoms of the ...

Embodiment 2

[0043] Preparation of T1 pure copper / 1060 pure aluminum composites with high interfacial bonding strength.

[0044] At room temperature, the annealed soft state T1 pure copper plate (thickness 2mm) and the annealed soft state 1060 pure aluminum plate (thickness 3mm) were cleaned with alcohol and surface treated by louver grinding. Composite surface; and the surface treated pure copper plate and pure aluminum plate are docked side by side to obtain a copper / aluminum billet; then a single pass pre-cold rolling is carried out under the conditions of a rolling speed of 0.05m / s and a reduction of 39%. Composite to obtain the copper / aluminum cold-rolled pre-composite material; then, in the air atmosphere and under the conditions of heating temperature 540 ° C and heating time 2 minutes, the copper / aluminum cold-rolled pre-composite material is heated at a high temperature for a short time to make the copper / aluminum cold-rolled pre-composite material The composite interface atoms of...

Embodiment 3

[0046] Preparation of T1 pure copper / 3003 aluminum alloy composites with high interfacial bonding strength.

[0047] At room temperature, the annealed soft state T1 pure copper plate (thickness 2mm) and the annealed soft state 3003 aluminum alloy plate (thickness 6mm) were cleaned by alcohol and polished by grinding wheel. Composite surface; and the surface-treated pure copper plate and aluminum alloy plate are butted side by side to obtain a copper / aluminum billet; then single-pass cold rolling is carried out under the conditions of a rolling speed of 0.04m / s and a reduction of 37%. Pre-composite to obtain the copper / aluminum cold-rolled pre-composite material; then, in the air atmosphere and under the conditions of a heating temperature of 520 ° C and a heating time of 10 minutes, the copper / aluminum cold-rolled pre-composite material is heated at a high temperature for a short time to make the copper / aluminum cold-rolled The composite interface atoms of the pre-composite ma...

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Abstract

The invention discloses a forming method of a copper / aluminum composite material with high interface bonding strength, belonging to the technical field of metal layered composite material preparation. This forming method processes the surface to be compounded of the copper plate and the aluminum plate to obtain a macroscopic uneven surface to be compounded, and uses a louver to polish the compounded surface. The direction of the stripes formed by grinding is perpendicular to the rolling direction, and then the copper plate and the Aluminum plates are stacked up and down or side by side to obtain copper / aluminum billets, followed by single-pass low-pressure cold rolling pre-compounding, then high-temperature short-term heating, and finally single-pass hot rolling final compounding to obtain high interface bonding Strong copper / aluminum composite. The invention has the advantages of low requirement on the capacity of the rolling mill required to produce the copper / aluminum composite material, simple process, and low production cost, and can obtain a macroscopic composite interface of a non-straight artificial structure and a microscopic composite interface of a particle pinning structure, and the interface is combined The strength is greater than or equal to 90MPa, and the range of applicable copper / aluminum composite materials is wide, which is easy for industrial promotion.

Description

technical field [0001] The invention belongs to the technical field of metal layered composite material preparation, and in particular provides a forming method of copper / aluminum composite material with high interfacial bonding strength. Background technique [0002] With the rapid development of science and technology and economic society, the national economy and national defense and military fields have higher and higher requirements for material performance, and the requirements for material structure improvement are also becoming stronger and stronger. A single metal material can no longer meet the requirements of practical applications. Higher performance requirements are constantly being raised. Therefore, metal layered composite materials with the physical, chemical and mechanical properties and price advantages of different metal materials came into being. Copper / aluminum composite materials are composed of copper and aluminum materials laminated up and down or si...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21B1/38B21B47/00
CPCB21B1/38B21B47/00B21B2001/386
Inventor 刘雪峰张利王浩白于良石章智王文静
Owner UNIV OF SCI & TECH BEIJING
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