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Dustproof cap-support chip integrated loudspeaker

A technology of loudspeaker and dust cap, applied in the field of loudspeakers, can solve the problems of difficult to guarantee sound quality, poor assembly, increase the height of the loudspeaker, etc., and achieve the effect of good stability and low distortion

Pending Publication Date: 2020-01-14
JIAXING KEYSOUND ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the ultra-thin speaker is limited by space, its sound quality cannot be guaranteed, and its power cannot be increased. Therefore, this is also a problem in the development of high-power ultra-thin speakers today.
The sound quality of the speaker is mainly determined by the magnetic circuit system and the sound cone. In an ultra-thin speaker, in order to increase its power, the gap between the voice coil and the magnetic circuit system is narrowed. In this case, poor assembly is likely to occur, and the friction between the voice coil and the magnetic gap abnormal sound
In addition, in order to ensure that the sound basin has enough vibration space and the voice coil has a good centering limit, the slope of the sound basin is generally made larger, which will increase the height of the speaker; Adding struts in between ensures good centering of the voice coil, which also results in increased speaker height
In view of this, the thickness of such high-power speakers still does not meet the needs of modern technological development

Method used

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  • Dustproof cap-support chip integrated loudspeaker
  • Dustproof cap-support chip integrated loudspeaker
  • Dustproof cap-support chip integrated loudspeaker

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment one, such as Figure 1-3 As shown, a dust cap-support integrated loudspeaker according to an embodiment of the present invention includes a frame 1, a magnetic circuit system located at the center of the frame 1, and a vibration system located at the periphery of the magnetic circuit system, Wherein, the vibration system includes a sound cone 2 and a voice coil 3, the outer side of the sound cone 2 is fixed with the basin frame 1 through a ring 4, and the center of the sound cone 2 is provided with a through hole, and the through hole is connected to the The voice coil 3 is fixed, the voice coil 3 is arranged on the periphery of the magnetic circuit system, the voice coil 3 is connected with a support piece 5, and the other end of the support piece 5 is fixed on the magnetic circuit system, wherein, The support piece 5 not only plays the role of centering the voice coil 3, but also plays the role of a dustproof cap. The magnetic circuit system includes a magn...

Embodiment 2

[0025] Embodiment two, such as Figure 4-5 As shown, the magnetic circuit system includes a gasket 9, a magnetic piece 7, a magnetic steel 8, and a magnetic bowl 6 from top to bottom, wherein the magnetic bowl 6 is installed inside the basin frame 1, and the support piece 5, the peripheral bonding position is bonded to the voice coil 3 , and the gasket 9 is bonded to the middle part of the support piece 5 , and the gasket 9 is located between the support piece 5 and the magnetic piece 7 .

[0026] This design is suitable for all speakers, especially for ultra-thin mid-bass speakers. After adding the support piece 5, the magnetic gap can be greatly reduced, the sound quality of the speaker can be improved, and the power can be increased. According to this design, the installation height of the speaker can be reduced to 16mm or even lower.

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Abstract

The invention discloses a dustproof cap-support chip integrated loudspeaker. The loudspeaker comprises a basin stand, a magnetic circuit system arranged at the center of the basin stand and a vibration system located at the periphery of the magnetic circuit system, wherein the vibration system comprises a sound cone and a voice coil; the outer side of the sound cone is fixed with the basin stand through a folding ring. The center of the sound cone is provided with a through hole, wherein the through hole is fixed with the voice coil, the voice coil is arranged at the periphery of the magneticcircuit system, the voice coil is connected with a support chip, the other end of the support chip is fixed on the magnetic circuit system, the magnetic circuit system sequentially comprises a magnetic sheet, magnetic steel and a magnetic bowl from top to bottom, and the magnetic bowl is arranged inside the basin stand. The loudspeaker has the beneficial effects that the support chip is designed above the voice coil and the magnetic circuit, and the characteristics of high power, low distortion and good stability are realized on the premise that the loudspeaker is ultrathin.

Description

technical field [0001] The invention relates to the technical field of loudspeakers, in particular to a dustproof cap-support piece integrated loudspeaker. Background technique [0002] At present, with the advancement of technology and the continuous improvement of consumer demand, audio-visual products such as smart speakers and flat-panel TVs are developing in the direction of large-area, high-resolution, ultra-thin, and high-power. Because the ultra-thin speaker is limited by space, its sound quality cannot be guaranteed, and its power cannot be increased. Therefore, this is also a problem in the development of high-power ultra-thin speakers today. The sound quality of the speaker is mainly determined by the magnetic circuit system and the sound cone. In an ultra-thin speaker, in order to increase its power, the gap between the voice coil and the magnetic circuit system is narrowed. In this case, poor assembly is likely to occur, and the friction between the voice coil a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/02H04R9/06H04R2307/00
Inventor 彭林梓
Owner JIAXING KEYSOUND ELECTRONICS CO LTD
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