Mobile terminal mainboard

A mobile terminal and motherboard technology, which is applied in the field of sound and electricity, can solve the problem of MEMS microphones that are not suitable for mobile terminal motherboards, and achieve the effect of improving electromagnetic shielding ability and reducing radio frequency noise.

Inactive Publication Date: 2020-01-24
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0005] In view of the above problems, the purpose of the present invention is to provide a mobile terminal motherboard to solve th

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  • Mobile terminal mainboard
  • Mobile terminal mainboard
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Embodiment Construction

[0034] Aiming at the aforementioned problem that the MEMS microphone with double shell structure is not compatible with the existing mobile terminal motherboard, the present invention provides a mobile terminal motherboard compatible with the double shell MEMS microphone, so as to solve the above problems.

[0035] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] In order to illustrate the structure of the mobile terminal motherboard provided by the present invention, Figure 1 to Figure 4 The structure of the mainboard of the mobile terminal is exemplarily marked from different angles. specifically, figure 1 Shows the circuit of the main board of the mobile terminal according to the embodiment of the present invention; diagram 2-1 shows a cross-sectional structure of a MEMS microphone according to an embodiment of the present invention; Figure 2-2 The pad structure of the MEMS micropho...

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Abstract

The invention provides a mobile terminal mainboard. The mobile terminal mainboard comprises a double-shell MEMS microphone and a mobile terminal PCB (Printed Circuit Board) matched with the double-shell MEMS microphone, the double-shell MEMS microphone is of a packaging structure formed by assembling a double-layer metal shell and a microphone PCB. The double-layer metal shell comprises an outer-layer metal shell and an inner-layer metal shell; a preset distance is arranged between the two layers of metal shells, the two layers of metal shells are respectively fixed with the microphone PCB, and the bottom of the microphone PCB is provided with an outer-layer shell grounding pad electrically connected with the outer-layer metal shell, an inner-layer shell grounding pad electrically connected with the inner-layer metal shell and a chip grounding pad electrically connected with the microphone chip; the mobile terminal PCB is provided with a first bonding pad electrically connected with the outer shell grounding bonding pad, a second bonding pad electrically connected with the inner shell grounding bonding pad, and a third bonding pad electrically connected with the chip grounding bonding pad. According to the invention, the problem that the MEMS microphone with the double-shell structure is not matched with the existing mobile terminal mainboard and the like can be solved.

Description

technical field [0001] The present invention relates to the field of acoustic and electric technologies, and more specifically, relates to a mobile terminal mainboard that can be adapted to a double-shell microphone. Background technique [0002] With the progress of society and the development of technology, in recent years, the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, and people's requirements for the performance of these portable electronic products are also getting higher and higher. The size continues to decrease, and the performance and consistency continue to increase. MEMS (Micro-Electro-Mechanical-System, MEMS for short) process-integrated MEMS microphones have begun to be applied in batches to electronic products such as mobile phones and notebook computers. Their packaging volume is smaller than that of traditional electret microphones, so they are popular Most microphone manufacturers of all ages. ...

Claims

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Application Information

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IPC IPC(8): H04R1/08H04R1/22H05K3/34
CPCH04R1/08H04R1/222H05K3/341
Inventor 袁兆斌王友
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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