A silicon capacitance microphone and its making method

A technology of silicon capacitors and microphones, applied in electret electrostatic transducers, electrostatic transducer microphones, etc., can solve problems such as difficult operation and limited production efficiency of silicon capacitor microphones, and achieve reduced overall thickness and good electromagnetic shielding Effects, Simple Effects

Active Publication Date: 2008-08-06
SHENZHEN HORN AUDIO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the acoustic sensor chip can only be mounted by a single point of glue, and cannot be mounted by the whole board printing process, which limits the production efficiency of the silicon capacitive microphone to a certain extent, and is not easy to operate during the production process.

Method used

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  • A silicon capacitance microphone and its making method
  • A silicon capacitance microphone and its making method
  • A silicon capacitance microphone and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] The silicon capacitive microphone of this specific embodiment, as shown in FIG. 1 , includes a housing 1 and a substrate assembly. The substrate assembly includes a substrate 17 and an acoustic sensor chip 8 , an IC device 7 and other passive devices 6 mounted on the substrate 17 . The edge of the housing 1 is fixed to the substrate 17 by conductive glue or solder paste 5 , and a cavity 14 is formed between the housing 1 and the substrate 17 .

[0064] In the silicon condenser microphone of this embodiment, the substrate 17 includes an upper substrate 2 and a lower substrate 3 . The upper substrate 2 and the lower substrate 3 are fixed and electrically connected through the connection pad 9 .

[0065] The acoustic sensor chip 8 is located in the cavity 14 and bonded on the upper surface of the upper substrate 2 by the acoustic sensor adhesive 13 . The acoustic sensor chip 8 is electrically connected to the upper substrate 2 through a bonding process (the bonding line ...

Embodiment 2

[0097] The structure of the silicon capacitive microphone in this specific embodiment is shown in FIG. 13 . The difference from Embodiment 1 is that the output terminal pad 10 for connecting with the client circuit board is arranged on the upper surface of the upper substrate and is located at the periphery of the casing 1 . The advantage of this structure is that it can provide another way to connect with the client. The main body of the silicon condenser microphone can be accommodated in the hole dug on the circuit board of the client to meet the needs of the client. The scheme about expanding the acoustic cavity 11 in the first embodiment is also applicable to this embodiment.

[0098] The manufacturing method of the silicon capacitive microphone in this specific embodiment is almost the same as that in Embodiment 1, the only difference is that in the first step, the upper entire board 20 and the lower entire board 21 are fabricated by using printed circuit board technology...

Embodiment 3

[0100] The structure of the silicon capacitive microphone in this specific embodiment is shown in FIG. 14 . The difference from the first embodiment is that the acoustic sensor chip 8 and the IC device 7 are bonded on the upper surface of the lower substrate 3 and located in the receiving hole 4 opened on the upper substrate 2 . The acoustic sensor chip 8 and the IC device 7 are electrically connected to the lower substrate through bonding wires. Other passive components 6 are bonded on the upper substrate 2 through conductive glue or solder paste 5 and are electrically connected to the upper substrate 2 . Since the height of the acoustic sensor chip 8 and the IC device 7 is generally greater than that of other passive devices 6, the cavity 14 can accommodate the acoustic sensor chip 8 and the IC device 7, and the thickness of the substrate can be properly reduced. Therefore, the advantage of adopting this structure is that the overall height of the silicon condenser micropho...

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PUM

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Abstract

The invention discloses a silicon electret condenser microphone and a method for making the same. The silicon electret condenser microphone comprises a shell, an acoustic transducer chip, an IC device, other passive components and a substrate, wherein the shell and the substrate are fixed together and form a cavity, and the shell and/or the substrate is provided with sound inlets; the acoustic transducer chip, the IC device and other passive components are positioned in the cavity and are respectively fixed and electrically connected with the substrate; the substrate is provided with an output end bond pad; an acoustic cavity is formed between the acoustic transducer chip and the substrate, and the substrate has a first mounting surface and a second mounting surface, with the acoustic transducer chip and the IC device fixed on the first mounting surface, and the other passive components fixed on the second mounting surface. The silicon electret condenser microphone in the technical proposal of the invention has two mounting surfaces for mounting elements, with the other passive components arranged on the second mounting surface and, the acoustic transducer chip and the IC device arranged on the first mounting surface, thereby realizing full page printing and improving the production efficiency.

Description

technical field [0001] The invention relates to the technical field of microphone production, in particular to a silicon capacitive microphone and a manufacturing method thereof. Background technique [0002] At present, the development of microelectromechanical system (MEMS) technology has opened up a new technology and field. Micro-sensors, micro-actuators, micro-components, micro-mechanical optical devices, vacuum microelectronic devices, and power electronic devices made of MEMS technology are widely used in aviation, aerospace, automobiles, biomedicine, environmental monitoring, military and almost everything that people come into contact with. There are very broad application prospects in all fields. [0003] The silicon condenser microphone is a MEMS sensor, which is a research hotspot in the field of electroacoustic technology, and it is also the direction to replace the traditional electret condenser microphone in the future. In existing silicon capacitive microph...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/01H04R19/04
Inventor 朱彪孙勇娟
Owner SHENZHEN HORN AUDIO
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