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Electromagnetic shielding film and preparation method thereof

A technology of electromagnetic shielding film and shielding layer, which is applied in the fields of magnetic field/electric field shielding, chemical instruments and methods, electrical components, etc., and can solve problems such as the electromagnetic wave reflection effect does not have the electromagnetic wave absorption function, the shielding effect is not ideal, and the structure of the shielding film is single. , to achieve the effect of facilitating industrial promotion and application, improving electromagnetic shielding efficiency, and enhancing electromagnetic shielding function

Inactive Publication Date: 2018-01-16
허난구오안일렉트릭머터리얼컴퍼니리미티드
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing shielding film has a single structure, which only has the effect of electromagnetic wave reflection and does not have the function of electromagnetic wave absorption, and the shielding effect is not ideal

Method used

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  • Electromagnetic shielding film and preparation method thereof
  • Electromagnetic shielding film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A kind of electromagnetic shielding film, its structure is as figure 1 As shown, the preparation process is as follows figure 2 shown, including the following steps:

[0044] (1) Prepare a release film layer, the raw materials include 45% release agent grease, 5% curing agent, and 50% solvent;

[0045] (2) The insulating layer and black insulating layer are prepared by 23% insulating resin, 4% curing agent, 0.5% accelerator, 8% filler and 7.8% flame retardant, and the insulating layer is coated on the release film by coating process layer, and then coat a black insulating layer on the other side of the insulating layer, and then plate copper on the other side of the black insulating layer through a coating process to form a metal layer with a thickness of 100 nanometers to obtain a semi-finished product;

[0046] (3) Prepare conductive glue with 12% epoxy resin and 65% conductive powder, and apply conductive glue on the metal layer;

[0047] (4) On the other side of...

Embodiment 2

[0049] A kind of electromagnetic shielding film, raw material and preparation method are as follows:

[0050] (1) Prepare a release film layer, the raw materials include 45% release agent grease, 5% curing agent, and 50% solvent;

[0051] (2) The insulating layer and black insulating layer are prepared by 23% insulating resin, 4% curing agent, 0.5% accelerator, 8% filler and 7.8% flame retardant, and the insulating layer is coated on the release film by coating process layer, and then coat a black insulating layer on the other side of the insulating layer, and then plate copper on the other side of the black insulating layer through a coating process to form a metal layer with a thickness of 200nm to obtain a semi-finished product;

[0052] (3) Prepare conductive glue with 12% epoxy resin, 65% conductive powder and 1% carbon nanotube, and coat the conductive glue on the metal layer;

[0053] (4) On the other side of the conductive adhesive, a shielding film is prepared throug...

Embodiment 3

[0055] A kind of electromagnetic shielding film, raw material and preparation method are as follows:

[0056] (1) Prepare a release film layer, the raw materials include 40% release agent grease, 3.8% curing agent, and 56.2% solvent;

[0057] (2) The insulating layer and black insulating layer are prepared by 30% insulating resin, 6% curing agent, 0.8% accelerator, 5% filler and 8% flame retardant, and the insulating layer is coated on the release film by coating process layer, and then coat a black insulating layer on the other side of the insulating layer, and then plate copper on the other side of the black insulating layer through a coating process to form a metal layer with a thickness of 150nm to obtain a semi-finished product;

[0058] (3) Prepare conductive glue with 17% epoxy resin, 55% conductive powder and 1% graphene, and coat the conductive glue on the metal layer;

[0059] (4) On the other side of the conductive adhesive, a shielding film is prepared through a c...

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Abstract

An electromagnetic shielding film comprises a release film layer, an insulating layer, a black insulating shielding layer, a metal layer, a conductive adhesive layer and a protective film layer whichare connected in order, the conductive adhesive layer comprises an electromagnetic wave absorbent, and the electromagnetic wave absorbent is a mixture of one or more than one selected from a carbon nanotube , Graphene and ferrite. The preparation method of the electromagnetic shielding film comprises the following steps: preparing a release agent, and obtaining a release film layer through a coating process; preparing the insulating layer and the black insulating shielding layer according to a formula, coating the insulation layer on the release film layer according to the coating process, coating the black insulating shielding layer on the other surface of the insulating layer, and plating metal at the other surface of the black insulating shielding layer through the coating process to form a metal layer and obtain a semi-finished product; preparing a conducting adhesive, and coating the conducting adhesive on the metal layer; and preparing a protective film on the other surface of the conductive adhesive through the coating process to obtain the semi-finished product.

Description

technical field [0001] The invention belongs to the field of electromagnetic shielding films, in particular to an electromagnetic shielding film and a preparation method thereof. Background technique [0002] In recent years, with the development of information and communication equipment, electromagnetic shielding films have become more and more widely used. Electromagnetic shielding film is also called EMI protective film, or absorbing material. Mainly after the punching process, it can weaken or eliminate the electromagnetic interference of the internal circuit by pressing it on the non-adhesive copper clad laminate or the cover film. This material is widely used in the flexible circuit board (FPC) industry. Flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board or FPC, with high wiring density and light weight. , Thin thickness, flexible shape design and other advantages, s...

Claims

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Application Information

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IPC IPC(8): H05K9/00
CPCB82Y30/00H05K9/0088B32B15/092B32B2307/212H05K9/0083H05K9/0084H05K9/00
Inventor 崔清臣李国法宋雯娟
Owner 허난구오안일렉트릭머터리얼컴퍼니리미티드
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