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Film formation device for target material

A film-forming device and target material technology, which is applied in the direction of metal material coating process, ion implantation plating, coating, etc., can solve the problems of difficult sintering and forming of the target material, increase the cost of the target material, etc., and achieve low cost and high film formation. continuous uniform effect

Inactive Publication Date: 2020-02-04
SHANGHAI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method requires the modification of the production line, and the sintering of the target is difficult, which increases the cost of the target

Method used

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  • Film formation device for target material
  • Film formation device for target material
  • Film formation device for target material

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] The object of the present invention is to provide a target film-forming device to solve the above-mentioned problems in the prior art, so that the film formation at the groove of the substrate is continuous, the cost is lower than that of the rotary target, and the modification to the production line is small.

[0018] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be f...

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Abstract

The invention discloses a film formation device for a target material and relates to the technical field of film formation for target materials. The device comprises a baseplate and the target material which are symmetrically arranged, the side, away from the baseplate, of the target material is provided with a magnet, and a rotation shaft penetrates through the magnet; the rotation shaft is perpendicular to the motion direction of the baseplate and can drive the two ends of the magnet to be close to or away from the baseplate to swing; the side, close to the target material, of the baseplateis evenly provided with grooves; an electric field is arranged between the target material and the baseplate. According to the film formation device for the target material, firm formation is continuous at the grooves of the baseplate, the cost of the target material is lower than that of a rotation-type target material, and the production line is less changed.

Description

technical field [0001] The invention relates to the technical field of target film formation, in particular to a target film formation device. Background technique [0002] At present, the magnetron sputtering technology used in the industrial production process basically uses planar targets. During the sputtering process, the target is fixed, the magnetic field moves back and forth, and the substrate moves relative to the target. This mode conforms to the production beat and also has high target utilization efficiency. However, since the target is flat, after argon ions bombard the surface of the target, most of the target reaches the surface of the substrate along a single direction, so that the film formation is uniform, but at the steps or grooves of the larger corners, there is a problem of film formation. The problem of discontinuity, because there is a height difference at the step, and when the angle is too large, the film is easy to break. Therefore, there is a ro...

Claims

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Application Information

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IPC IPC(8): C23C14/35
CPCC23C14/35
Inventor 李喜峰杨世博袁雁妤于正航
Owner SHANGHAI UNIV