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Heat dissipating device and refrigerating device

A heat sink and heat dissipation channel technology, which is applied in the field of heat dissipation of refrigeration equipment, can solve problems such as poor heat dissipation effect of the heat sink at the hot end, and achieve the effect of improving the heat dissipation effect

Pending Publication Date: 2020-02-04
QINGDAO HAIER SMART TECH R & D CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present disclosure provide a radiator and refrigeration equipment to solve the technical problem of poor heat dissipation effect of the radiator at the hot end

Method used

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  • Heat dissipating device and refrigerating device
  • Heat dissipating device and refrigerating device
  • Heat dissipating device and refrigerating device

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Embodiment Construction

[0029] In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

[0030] Herein, the terms "first", "second", etc. are only used to distinguish one element from another element without requiring or implying any actual relationship or order between these elements. In fact the firs...

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Abstract

The invention relates to the technical field of heat dissipating of refrigerating devices, and discloses a heat dissipating device. The heat dissipating device comprises a heat transferring base platein which a heat transferring channel is arranged, a heat dissipating base plate in which a heat dissipating channel is arranged, a heat dissipating fin set which is arranged on the heat dissipating base plate and is provided with a gap that forms a storing space, and a communication pipeline for connecting the heat transferring channel and the heat dissipating channel. According to the heat dissipating device provided by the embodiment, the heat dissipating fin set is provided with the gap which forms the storing space in which a fan can be stored, and heat among fins can be timely dissipated, so that the heat dissipating effect of the heat dissipating device at the heat end can be improved. The invention also discloses a refrigerating device.

Description

technical field [0001] The present application relates to the technical field of heat dissipation of refrigeration equipment, for example, it relates to radiators and refrigeration equipment. Background technique [0002] At present, with the development of semiconductor refrigeration technology, semiconductor refrigeration equipment using semiconductor refrigeration chips for refrigeration is widely used. The semiconductor refrigeration chip includes a cold end that releases cold energy and a hot end that releases heat. The cold end releases cold energy to the cooling space of the refrigeration device through the cold end radiator, and the hot end releases heat to the outside through the hot end radiator. . [0003] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art: the heat dissipation effect of the existing heat sink at the hot end is not good, which affects the cooling ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02
CPCF25B21/02F25B2321/025
Inventor 王大伟王定远徐佳裴玉哲
Owner QINGDAO HAIER SMART TECH R & D CO LTD