Transfer printing method and transfer printing head based on liquid capillary force and surface tension

Abstract

The invention provides a transfer printing method and a transfer printing head based on liquid capillary force and surface tension. The transfer printing method comprises the steps of liquid film forming, wherein liquid is applied to the transfer printing face of the transfer printing head, the liquid can form a liquid film between the transfer printing face and a thin film device, and the capillary force and the surface tension of the liquid film serve as the binding force between the transfer printing face and the thin film device; lifting, wherein the liquid is utilized for forming first binding force between the transfer printing face and the thin film device, the first binding force is larger than the binding force between the thin film device and an original substrate, and the transfer printing head is moved to enable the thin film device to be separated from the original substrate; and putting down, wherein the thin film device makes contact with a target substrate, the shape ofthe transfer printing face and/or the liquid amount of the liquid film are/is adjusted to form second binding force between the transfer printing face and the thin film device, the second binding force is smaller than the binding force between the thin film device and the target substrate, and the transfer printing head is moved to enable the thin film device to be separated from the transfer printing head. The transfer printing method is simple and easy to implement, transfer printing is achieved through the liquid effect, and the yield is high.

Description

technical field [0001] The invention relates to the technical field of transfer printing, and in particular to a transfer printing method and a transfer printing head based on liquid capillary force and surface tension. Background technique [0002] Flexible electronic devices are often prepared on a flat silicon substrate. However, in the IC (Integrated Circuit Integrated Circuit) process, silicon itself is a brittle material and cannot be stretched or bent. Therefore, the prepared thin film device needs to be Transferring from a silicon substrate to a deformable flexible substrate is called transfer printing. [0003] The existing transfer printing methods are easy to cause damage to flexible electronic devices or thin film devices, resulting in low yield and unsatisfactory transfer printing effect. A technical problem that urgently needs to be solved by those skilled in the art is how to provide a transfer printing method that has a good transfer printing effect on thin ...

AI Technical Summary

Problems solved by technology

[0003] The existing transfer printing method is easy to cause damage to flexible electronic de

Images