Transfer printing method and transfer head based on liquid capillary force and surface tension

A technology of surface tension and capillary force, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of flexible electronic device film device damage, low yield, unsatisfactory transfer effect, etc.

Active Publication Date: 2022-03-01
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing transfer printing method is easy to cause damage to flexible electronic devices or thin film devices, resulting in low yield and unsatisfactory transfer printing effect

Method used

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  • Transfer printing method and transfer head based on liquid capillary force and surface tension
  • Transfer printing method and transfer head based on liquid capillary force and surface tension
  • Transfer printing method and transfer head based on liquid capillary force and surface tension

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Embodiment Construction

[0036] Exemplary embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present invention, but are not intended to exhaust all possible ways of the present invention, nor are they intended to limit the scope of the present invention.

[0037] like figure 1 and figure 2 As shown, the present disclosure provides a transfer printing method based on liquid capillary force and surface tension, which utilizes a transfer head 1 to separate a thin film device 2 from an original substrate. In a specific embodiment, the transfer printing method comprises the following steps:

[0038] The preparation step of the thin film device 2: forming the thin film device 2 on the original substrate.

[0039] The liquid film 3 forming step: apply liquid on the transfer surface of the transfer head 1, the liquid can form a liq...

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Abstract

Provided are a transfer method and a transfer head based on liquid capillary force and surface tension. The transfer printing method includes: liquid film forming step: apply liquid on the transfer printing surface of the transfer printing head, the liquid can form a liquid film between the transfer printing surface and the thin film device, and the capillary force and surface tension of the liquid film are used as a link between the transfer printing surface and the thin film device. The bonding force between; lifting step: utilize liquid to form the first bonding force between transfer printing surface and thin-film device, and first bonding force is greater than the bonding force between thin-film device and original substrate, move transfer printing head and make thin-film device from The original substrate is detached; put down the step: make the thin film device contact the target substrate, adjust the shape of the transfer surface and / or the liquid amount of the liquid film to form a second bonding force between the transfer surface and the thin film device, the second bonding force is smaller than the thin film The bonding force between the device and the target substrate moves the transfer head to release the thin film device from the transfer head. The transfer printing method is simple and easy, relies on the liquid effect to realize the transfer printing, and has a high yield.

Description

technical field [0001] The invention relates to the technical field of transfer printing, and in particular to a transfer printing method and a transfer printing head based on liquid capillary force and surface tension. Background technique [0002] Flexible electronic devices are often prepared on a flat silicon substrate. However, in the IC (Integrated Circuit Integrated Circuit) process, silicon itself is a brittle material and cannot be stretched or bent. Therefore, the prepared thin film device needs to be Transferring from a silicon substrate to a deformable flexible substrate is called transfer printing. [0003] The existing transfer printing methods are easy to cause damage to flexible electronic devices or thin film devices, resulting in low yield and unsatisfactory transfer printing effect. A technical problem that urgently needs to be solved by those skilled in the art is how to provide a transfer printing method that has a good transfer printing effect on thin ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
CPCH01L21/02H01L21/02104
Inventor 冯雪刘鑫马寅佶
Owner TSINGHUA UNIV
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