Device packaging module and preparation method thereof and electronic device
A technology for device packaging and packaging carrier boards, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, electrical solid-state devices, etc., and can solve problems such as delamination, excessive warpage of device packaging modules, and voids in plastic packaging. , to achieve the effect of preventing internal plastic sealing voids
Active Publication Date: 2020-02-04
VIVO MOBILE COMM CO LTD
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Problems solved by technology
[0005] The invention discloses a device packaging module, a preparation method of the device packaging module and electronic equipment, so as to solve the problems of excessive warping, plastic sealing voids and delamination phenomena in the device packaging module of the existing electronic equipment
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[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0028] Such as Figure 1-Figure 4 As shown, the present invention discloses a device packaging module, and the disclosed device packaging module includes a packaging substrate 100 , a plastic se...
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The invention discloses a device packaging module. The device packaging module comprises a packaging carrier plate (100), a plastic packaging part (200) and a functional device (300), wherein the functional device (300) is arranged on the packaging carrier plate (100); the plastic packaging part (200) covers the functional device (300); a gap (400) is formed between the packaging carrier plate (100) and the plastic packaging part (200); and the gap (400) is communicated with the external environment of the device packaging module. The invention further discloses a preparation method of the device packaging module and electronic equipment. According to the scheme, the problems of overlarge warping, plastic packaging holes, layering and the like in the device packaging module of the existingelectronic equipment can be solved.
Description
technical field [0001] The invention relates to the technical field of communication equipment, in particular to a device packaging module, a preparation method of the device packaging module and electronic equipment. Background technique [0002] With the advancement of technology and the development of electronic equipment, users have higher and higher demands on electronic equipment, so more and more functional devices need to be placed on the electronic equipment. Since most of the functional devices are disposed in the inner cavity of the housing of the electronic equipment, more and more space needs to be occupied. However, in order to improve the portability and comfort of use of the electronic device, the overall size of the electronic device usually needs to be smaller. [0003] Current electronic equipment generally adopts system packaging technology to integrate some functional devices, and uses injection molding technology to wrap functional devices with plastic...
Claims
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IPC IPC(8): H01L23/31H01L25/18H01L21/56
CPCH01L25/18H01L23/3121H01L21/56H01L2924/181H01L2924/19105H01L2224/16225H01L2924/00012
Inventor 杨俊
Owner VIVO MOBILE COMM CO LTD