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Power conversion circuit device

A technology for power conversion circuits and housings, which is applied to circuits, electrical components, electrical solid devices, etc., can solve problems such as difficult alignment and fixation, and easily damaged chips 102, and achieves convenient PCB board installation, accurate installation, and avoidance of The effect of destroying the chip

Inactive Publication Date: 2019-04-19
江苏双聚智能装备制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the conductive terminal 104 is relatively hard, soldering is easy to damage the chip 102, and the top of the conductive terminal 104 is generally electrically connected to a circuit board, which is not easy to align and fix.

Method used

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Embodiment Construction

[0025] The idea of ​​the present invention is to design a power packaging structure that prevents warpage and chip damage. The basic idea is that the stacked structure of the resin layer and the reinforcement plate realizes the above functions. The specific embodiments will be described in the following content.

[0026] see figure 2 , the power conversion circuit device of the present invention, which includes:

[0027] Heat dissipation substrate 1, the heat dissipation substrate 1 is a metal plate, ceramic plate, etc., its lower surface can be welded or riveted with a heat sink, and the heat sink can be a fin-shaped heat sink, a microporous heat sink, an air-cooled heat sink, etc. Preferably, the heat dissipation substrate 1 is a metal plate made of copper.

[0028] A housing 5, disposed on the heat dissipation substrate 1, and the housing 5 has a step 6 at its top;

[0029] Copper-clad substrate, which is welded on the heat dissipation substrate 1, and is located in the ...

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PUM

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Abstract

The invention provides a power conversion circuit device. The power conversion circuit device is characterized in that through holes in a resin layer are filled with solder, and lead-out of conductiveterminals can be carried out through a mending plate, thus avoiding damaging chips during the welding process; the mending plate can partially resist the thermal stress of a heat radiation substrateto prevent excessive warping of the heat radiation substrate; and positioning bulges are formed on the mending plate, so that a PCB can be conveniently mounted and mounting is more accurate and in-place.

Description

technical field [0001] The invention relates to the field of packaging of semiconductor devices, in particular to the field of packaging of power conversion devices, and relates to a power conversion circuit device. Background technique [0002] The packaging of existing power conversion chips is mostly carried out on the same level. This kind of packaging is conducive to the need for thinning, but it is very unfavorable for reducing lateral dimensions, facilitating wiring, and improving heat dissipation efficiency. For example, figure 1 The power conversion package shown includes a mounting substrate 100, a housing 101, a chip 102, a copper-clad substrate 103, conductive terminals 104, and solder 105, wherein the housing 101 is arranged on the mounting substrate 100, and the copper-clad The substrate 103 is installed in the housing, the chip 102 is fixed on the copper-clad substrate 103 , and the conductive terminals 104 are welded on the chip 102 by solder 105 . Since the...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L25/07H01L25/18
CPCH01L23/49827H01L23/49844H01L23/49894H01L25/072H01L25/18H01L2224/18
Inventor 苏童萍陈亚东钱畅
Owner 江苏双聚智能装备制造有限公司