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Heat sink and its preparation method and electronic equipment

A technology of heat sink and phase change heat storage material, which is applied to the structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of graphene heat storage and poor heat dissipation capacity, etc.

Active Publication Date: 2021-01-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the first aspect of the present application, an embodiment provides a method for preparing a heat sink to solve the above-mentioned technical problem of poor heat storage and heat dissipation capabilities when the thickness of the graphene is thin

Method used

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  • Heat sink and its preparation method and electronic equipment
  • Heat sink and its preparation method and electronic equipment
  • Heat sink and its preparation method and electronic equipment

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Embodiment Construction

[0027] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the application more thorough and comprehensive.

[0028] As used herein, "terminal equipment" refers to a device capable of receiving and / or sending communication signals, including but not limited to, connected via any one or several of the following connection methods:

[0029] (1) Connection via wired lines, such as public switched telephone network (Public Switched Telephone Networks, PSTN), digital subscriber line (Digital Subscriber Line, DSL), digital cable, direct cable connection...

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Abstract

The invention relates to a heat dissipation sheet, a preparation method of the heat dissipation sheet and electronic equipment. The preparation method of the heat dissipation sheet comprises the following steps of providing graphene powder; mixing the graphene powder with a phase change heat storage material, adding water and uniformly mixing the components to obtain a mixture, wherein the mass ratio of the phase change heat storage material to the graphene powder is 1 : 0.05-0.2; preparing composite material powder of the graphene and the phase change heat storage material from the mixture; and preparing the heat dissipation sheet from the composite material powder. According to the preparation method of the heat dissipation sheet, the heat dissipation sheet is prepared by adding the phase change heat storage material in the graphene powder according to the certain mass ratio. The phase change heat storage material is added into the graphene powder, so that the heat dissipation sheetcontains the phase change heat storage material, the heat storage capacity of the heat dissipation sheet is improved, and the high thermal conductivity coefficient of graphene in the horizontal direction is retained. On the premise that the good heat dissipation performance of the heat dissipation sheet is guaranteed, the thickness of the heat dissipation sheet can be reduced, so that the overallthickness of the electronic equipment can be reduced and the appearance performance of the heat dissipation sheet is improved.

Description

technical field [0001] The application relates to the technical field of electronic equipment, in particular to a heat sink, a preparation method thereof, and electronic equipment. Background technique [0002] The larger the thickness of the existing graphene, the stronger the heat storage capacity, which is more conducive to good heat dissipation; when the thickness is thinner, the heat storage capacity and heat dissipation capacity are poor. However, when applied to electronic equipment, thicker graphene will increase the thickness of the electronic equipment, which is not conducive to the expressiveness of the product. Contents of the invention [0003] In the first aspect of the present application, an embodiment provides a method for preparing a heat sink, so as to solve the above-mentioned technical problem of poor heat storage and heat dissipation capabilities when the thickness of the graphene is thin. [0004] A method for preparing a heat sink, comprising the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20963H05K7/2099
Inventor 王雪锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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