A split anode device, electroplating equipment and method for improving coating uniformity

Abstract

The invention provides a segmented anode device, electroplating equipment and a method for improving the uniformity of the coating. The split anode device includes at least two anode plates, each of which is connected to the positive pole of the current supplier through a conductive connector, wherein the first anode plate is located in the center, and the subsequent anode plates are respectively arranged on the front anode plate The peripheral part of the outer edge of any anode plate is non-conductive between the outer edge of any anode plate and the inner edge of its peripheral adjacent anode plate, and there is a distance between adjacent anode plates in the thickness direction, the closer the anode is to the central position The distance between the plate and the cathode plate of the electroplating device is smaller. By setting different distances between each segmented anode plate and the cathode plate of the electroplating device, the strength of the electric force line at the cathode plate is adjusted to produce a similar electroplating rate, thereby improving the uniformity of the coating thickness on the electroplating piece.

Description

technical field [0001] The invention relates to the technical field of semiconductor and circuit board electroplating, in particular to a segmented anode device, electroplating equipment and a method for improving the uniformity of the coating. Background technique [0002] With the development of industry and science and technology, in the electroplating technology, higher and higher requirements are put forward for the quality of the electroplating layer, especially for the uniformity of the thickness of the electroplating layer. The factors affecting the uniformity of the thickness of the electroplating layer mainly include the following two aspects, one is the nature of the electroplating solution and the electroplating specification, and the other is the influence of the distribution of the cathode and anode in the electroplating equipment. in the attached figure 1 The electric field distribution between two parallel plate electrodes is shown in , the anode plate 91 ad...

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Problems solved by technology

in the attached figure 1 The electric field distribution between two parallel plate electrodes is shown in , the anode plate 91 adopts a whole flat plate, it can be seen that the electric force lines are dense near the edge of the cathode plate 90, the current density is larger during electroplating, and the coating is thicker. In actual electroplating, the cathode and anode adopt In this parallel plate method, the thickness difference of the coating can reach 70-80μm, which cannot meet the coating requirements at all.

The mainstream method adopted in the market is the divided anode method, which divides the anode plate into several small anode plates 92, and attaches figure 2 shows the distribution of the electric field in this way, compared with the attached figure 1 way, the electric field distribution is much more uniform, but in actual electroplating, the thickness difference of the coating is also about 15 μm, which still cannot meet the requirements of high uniformity of the electroplating layer for semiconductor devices such as wafers.

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