Conductive adhesive film, circuit board and preparation method of conductive adhesive film

Abstract

The invention relates to the field of electronic technologies, and discloses a conductive adhesive film, a circuit board, and a preparation method of the conductive adhesive film. The conductive adhesive film includes an adhesive film layer, a conductor layer, and a conductive adhesive layer. The conductor layer is arranged between the adhesive film layer and the conductive adhesive layer. The surface, which is near the adhesive film layer, of the conductor layer includes a plurality of first convex parts and a plurality of first concave parts. The plurality of first convex parts and the plurality of first concave parts are spaced apart. The plurality of first convex parts runs into the adhesive film layer. When the conductive adhesive film is pressed and used, the first convex parts pierce the adhesive film layer to contact and turn on the ground layer of the printed circuit board to ensure the contact and conduction between the conductive adhesive film and the ground layer of the printed circuit board. The grounding stability of the conductive adhesive film is effectively improved. In addition, the conductor layer is arranged, so that most of conductive particles in the conductive adhesive layer can contact the conductor layer, thereby increasing the overlap ratio of the conductive particles and reducing the resistance of the conductive adhesive film.

Description

technical field [0001] The invention relates to the technical field of electronics, in particular to a method for preparing a conductive adhesive film, a circuit board and the conductive adhesive film. Background technique [0002] Conductive adhesive films provide mechanical and electrical connections between components and circuit boards, and thus are gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, and conductive circuit bonding. [0003] At present, the existing conductive adhesive film generally includes a conductive adhesive layer, wherein the conductive adhesive layer has conductive particles; In the grounding hole, the conductive particles in the conductive adhesive layer are connected to the ground layer of the printed circuit board through the grounding hole, so that the static charge accumulated on the printed circuit board is led out. However, in the process of implementing the present invention, t...

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Problems solved by technology

However, in the process of implementing the present invention, the inventors found that there are at least the following problems in the prior art: due to the influence of stress, climate and other factors, the volume or shape of the matrix of the conductive adhesive film is prone to gradual or sudden changes, so that the internal The stacking state of conductive particles is easy to change, which makes the conductive path in the conductive adhesive film easy to change, resulting in unsatisfactory conduction effect between the conductive adhesive film and the ground layer of the circuit board, thus resulting in poor grounding stability of the conductive adhesive film

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