An intelligent device for semiconductor material production and its use method

Abstract

The invention discloses an intelligent device for semiconductor material production. The intelligent device comprises a housing, a turnover plate, a chip collecting groove, a first threaded rod, a first moving assembly, a clamping assembly, a bearing plate, a grinding disc, a connecting plate, an elastic assembly, a mounting plate, a second moving assembly and a protective cover, wherein the firstthreaded rod is connected to the turnover plate; a moving ring is movably arranged on the first threaded rod through the first moving assembly; the clamping assembly is connected to the peripheral side of the moving ring; the bearing plate is fixedly connected to the end, far away from the turnover plate, of the first threaded rod; a rotating shaft is fixedly connected to the center of the side surface, deviating from the bearing plate, of the grinding disc; the other end of the rotating shaft penetrates through a sleeve in a sliding mode to be fixedly connected with a crankshaft of a third motor; the connecting plate is connected with the mounting plate which is arranged in parallel with the grinding disc through the elastic assembly; and the mounting plate is further connected with thesecond moving assembly which is arranged on the turnover plate on one side of the bearing plate. The intelligent device for semiconductor material production has the advantages of being good in applicability, convenient to use and the like, and can be widely popularized and used.

Description

technical field [0001] The invention belongs to the technical field of semiconductor material production equipment, and in particular relates to an intelligent equipment for semiconductor material production and a use method thereof. Background technique [0002] Wafers are the basic material for manufacturing semiconductor chips. The main raw material for semiconductor integrated circuits is silicon, so the corresponding silicon wafers. Silicon exists widely in rocks and gravel in the form of silicate or silicon dioxide in nature. The manufacture of silicon wafers can be summarized into three basic steps: silicon extraction and purification, single crystal silicon growth, and wafer molding. [0003] When the wafer is packaged, it is generally necessary to reduce the thickness of the wafer through a grinding machine. The basic method is to realize the relative movement between the semiconductor wafer and the grinding wheel. At present, the exposed grinding of the thinning de...

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Problems solved by technology

[0003] When the wafer is packaged, it is generally necessary to reduce the thickness of the wafer through a grinding machine. The basic method is to realize the relative movement between the semiconductor wafer and the grinding wheel. At present, the exposed grinding of the thinning device has an impact on the working environment. , the built-in grinding is inconvenient to place, and the size and thickness of semiconductor wafers are different, the fixed structure is relatively fixed, and the adaptability is poor

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