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heat sink

A heat sink and heating element technology, which is applied in lighting and heating equipment, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc. Heating body and other problems, to achieve reliable cooling, suppress the generation of condensation, and suppress the effect of cooling

Active Publication Date: 2021-03-02
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the configuration of the heat sink in Patent Document 1, dew condensation may occur around a heat-generating electronic component (hereinafter referred to as a heat-generating body) due to excessive cooling.
On the other hand, when the heat capacity of the heat sink is reduced as in Patent Document 2, the temperature undershoot and overshoot become large, making it difficult to maintain the heat generating body at the target temperature.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0018] figure 1 It is a circuit diagram showing the state where the heat sink 1 according to Embodiment 1 of the present invention is installed in the air conditioner 400 . The air conditioner 400 has a heat source unit 200 and a plurality of load units 300 . The heat source unit 200 includes a compressor 211 , a flow switching device 212 , and a heat source side heat exchanger 213 . In addition, the heat source unit 200 has a control device and a temperature sensor 7 provided on the control device.

[0019] The compressor 211 compresses the refrigerant and discharges it. The flow switching device 212 is constituted by, for example, a four-way valve or the like, and switches the refrigerant flow path between the cooling operation and the heating operation. The heat source side heat exchanger 213 exchanges heat between the refrigerant discharged from the compressor 211 and air, functions as a condenser during cooling operation, and functions as an evaporator during heating o...

Embodiment approach 2

[0041] Image 6 It is a plan view showing the schematic structure of the heat sink 101 according to Embodiment 2 of the present invention. Figure 7 It is a side view which shows the state which attached the some heating element 6a, 6b to the heat sink 101 which concerns on Embodiment 2 of this invention. based on Image 6 and Figure 7 The heat sink 101 according to Embodiment 2 will be described. In Embodiment 1, the heat sink 1 cools one heat generating body 6, but in Embodiment 2, the heat sink 101 cools a plurality of heat generating bodies 6a, 6b. Hereinafter, the same reference numerals are assigned to the same configurations as those in Embodiment 1, and description thereof will be omitted.

[0042] The heating element 6 a and the heating element 6 b are attached to the other surface 105 of the cooling block 103 in the heat sink 101 . The area obtained by projecting the area where the heating element 6a is mounted on the side 104 is the projected area Rha, and the...

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Abstract

The heat sink includes pipes through which the cooled fluid flows; and a cooling block provided with pipes on one side and a heating element attached to the other side. A contact region where one surface contacts the pipe and a non-contact region where a gap is provided between the one surface and the pipe are formed at a position facing the pipe in the cooling block. The contact area is formed in a projected area obtained by projecting the area on which the heating element is attached onto one surface.

Description

technical field [0001] The present invention relates to a heat sink provided with pipes through which a cooling fluid flows. Background technique [0002] Conventionally, there are heat sinks for cooling electronic components including pipes through which cooled fluid flows and cooling blocks made of thermally conductive materials (for example, refer to Patent Document 1). Patent Document 1 discloses a heat sink in which a pipe is pressed against an installation groove provided in a cooling block and plastically deformed to eliminate a gap between the heat transfer block and the pipe to improve heat transfer performance. The cooling range of a heat sink composed of a cooling block and piping generally depends on the size of the cooling block and the contact area between the piping and the cooling block. [0003] In addition, some conventional heat sinks are installed in an air conditioner including a refrigerant circuit, and flow a refrigerant into a pipe to cool electronic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F25B1/00H01L23/473
CPCH01L23/473F25B1/00H05K7/20309H05K7/20254H05K7/20272
Inventor 水谷周平小池孝典
Owner MITSUBISHI ELECTRIC CORP