Wafer cleaning method and cleaning chamber

Abstract

Some embodiments of the present disclosure provide a wafer cleaning method, comprising: immersing a wafer in a bath in a cleaning chamber; removing the wafer from the bath, passing the solvent and feeding the wafer into the gas in the cleaning chamber; The gas determines the parameter value; and in response to the determined parameter value exceeding the threshold, remedial action is taken in the cleaning chamber. The present disclosure also relates to a cleaning chamber.

Description

technical field [0001] Embodiments of the present disclosure relate to a wafer cleaning method and a cleaning chamber. Background technique [0002] With the development of electronic products, semiconductor technology has been widely used in the manufacture of memories, central processing units (CPUs), liquid crystal displays (LCDs), light-emitting diodes (LEDs), laser diodes ( laser diodes) and other devices or chipsets. In order to achieve high integration and high speed requirements, the size of semiconductor integrated circuits has been reduced, and various materials and techniques have been proposed to achieve these requirements and overcome obstacles during fabrication. Controlling the conditions under which wafers are processed within a chamber or tank is an important part of semiconductor manufacturing technology. [0003] One of the important issues in semiconductor fabrication technology is contamination due to the formation or presence of unwanted particles dur...

AI Technical Summary

Problems solved by technology

However, despite the flow in the bath and the use of Marangoni drying techniques, particles may still deposit on the wafer surface and cause contamination

Therefore traditional techniques for avoiding particle contamination may require substantial expenditure and expensive hardware, but still cannot produce satisfactory results

So conventional techniques for avoiding pollution are not entirely satisfactory

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