High-precision laser cyclotomic equipment with cleaning function

Abstract

The invention relates to high-precision laser cyclotomic equipment with a cleaning function. The high-precision laser cyclotomic equipment with the cleaning function comprises a workbench and a control box; the control box is arranged over the workbench and is fixedly connected with the workbench; the workbench is provided with a through hole; the axis of the through hole is vertical to the workbench; a moving device is arranged on the workbench; a cutting mechanism and an auxiliary mechanism are arranged at the bottom of the control box; the cutting mechanism comprises a fixed pipe, a bearing, a connecting rod, a layer, a power assembly and a connecting assembly; and the connecting assembly comprises a moving pipe, a suction disc, a moving disc, an electromagnet, a spring, a moving unit and at least two limiting blocks. The high-precision laser cyclotomic equipment with the cleaning function achieves the cyclotomic function through the cutting mechanism; furthermore, the high-precision laser cyclotomic equipment with the cleaning function achieves the function of removing impurities from a workpiece through the auxiliary mechanism and avoids influence on laser absorption by the workpiece by the impurities.

Description

technical field [0001] The invention relates to the field of laser cutting, in particular to a high-precision laser circle cutting device with a cleaning function. Background technique [0002] The laser cutting machine uses a high-power-density laser beam to irradiate the material to be cut, so that the material is quickly heated to the vaporization temperature, and evaporates to form holes. As the beam moves to the material, the holes are continuously formed with a narrow width (such as about 0.1mm) Slit to complete the cutting of the material. [0003] During the use of the existing laser circle cutting machine, due to the non-contact processing, when the workpiece is subjected to external force, it is easy to cause relative movement between the workpiece and the laser, thus affecting the accuracy of the circle cutting. Not only that, the circle cutting During this period, more impurities will be produced, and the impurities will fall on the workpiece, which will affect ...

AI Technical Summary

Problems solved by technology

[0003] During the use of the existing laser circle cutting machine, due to the non-contact processing, when the workpiece is subjected to external force, it is easy to cause relative movement between the workpiece and the laser, thus affecting the accuracy of the circle cutting. Not only that, the circle cutting During this period, more impurities will be produced, and the impurities will fall on the workpiece, which will affect the laser absorption of the workpiece, thus affecting the circle cutting efficiency

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