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Lens module

A lens module and contact layer technology, applied in TV, color TV, printed circuit and other directions, can solve the problems affecting the shooting quality of the lens module, and achieve the effect of improving the camera quality, ensuring the flatness, and avoiding the tilt of the optical axis.

Inactive Publication Date: 2020-03-13
TRIPLE WIN TECHSHENZHEN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the optical load-bearing structure is fixed on the surface of the circuit board. Because the circuit board needs to meet the electrical transmission requirements and other reasons, the surface of the circuit board is usually uneven. In this way, it is easy to cause the optical axis of the optical load-bearing structure to tilt and affect The shooting quality of the lens module

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0050] see Figures 1 to 4 , is a lens module 100 provided in the first embodiment of the present invention, and this embodiment uses a zoom lens module as an example to illustrate the present invention. The lens module 100 includes a circuit board 10 , an image sensor 20 electrically connected to the circuit board 10 , an optical bearing structure 30 disposed on the circuit board 10 , and an optical sensor disposed on the circuit board 10 . Metal casing 40.

[0051] The circuit board 10 is a rigid board, a flexible board or a rigid-flex board. In this embodiment, the circuit board 10 is a rigid-flex board. The circuit board 10 includes a main body 12 and an extension 14 connected to the main body 12 . The main body 12 is used for setting the image sensor 20 , the optical carrying structure 30 and the metal casing 40 . The extension portion 14 is used to install an electrical connector 15 , and the electrical connector 15 is electrically connected to the image sensor 20 fo...

no. 2 example

[0061] see Figure 5 , is a circuit board 210 included in the lens module provided in the second embodiment. The structure of the circuit board 210 provided in this embodiment is basically the same as that of the circuit board 10 provided in the first embodiment, that is, the circuit board 210 includes a bearing surface 101, and the bearing surface 101 includes a circuit area 111 and a circuit area surrounding the circuit area. The peripheral area 121 of 111 , the circuit area 111 is provided with the image sensor 20 , and the peripheral area 121 is provided with a first contact layer 231 and a second contact layer 141 spaced from the first contact layer 231 . The difference is that: the first contact layer 231 includes a plurality of discontinuous metal segments 233 , and each metal segment 233 is strip-shaped. The length of each metal segment 233 is consistent with or slightly shorter than the length of each side of the bottom of the optical carrying structure 30 .

no. 3 example

[0063] see Figure 6 , is a lens module 300 provided in the third embodiment. The structure of the lens module 300 provided in this embodiment is basically the same as that of the lens module 100 provided in the first embodiment, that is, the lens module 300 includes a circuit board 10 , and an image sensing device electrically connected to the circuit board 10 . The detector 20 , the optical carrying structure 301 arranged on the circuit board 10 and the metal casing 40 arranged on the circuit board 10 . The difference is that the lens module 300 is a fixed-focus lens module, and the optical carrying structure 301 is a lens holder for accommodating the lens unit 330 . The metal casing 40 covers the optical carrying structure 301 and is fixed to the second contact layer 141. The shielding structure formed by the metal casing 40 and the second contact layer 141 can prevent external noise from affecting the image sensor. 20 signal interference to ensure the shooting quality. ...

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Abstract

A lens module comprises a circuit board and an optical bearing structure, and the circuit board comprises a bearing surface. The bearing surface comprises a photosensitive area and a peripheral area surrounding the photosensitive area. The photosensitive area is provided with an image sensor, the peripheral area is provided with a first contact layer, the first contact layer forms a frame-shaped structure with the same size as the bottom of the optical bearing structure, and the bottom of the optical bearing structure is fixed on the first contact layer.

Description

technical field [0001] The invention relates to a lens module. Background technique [0002] With the rapid development of multimedia technology, digital cameras, video cameras and mobile phones with cameras are more and more popular among consumers, and people have higher and higher requirements for the imaging quality of such devices, so it is necessary to continuously improve their internal camera module. In the prior art, the optical load-bearing structure is fixed on the surface of the circuit board. Because the circuit board needs to meet the electrical transmission requirements and other reasons, the surface of the circuit board is usually uneven. In this way, it is easy to cause the optical axis of the optical load-bearing structure to tilt and affect The shooting quality of the lens module. Therefore, it is necessary to provide a lens module that can overcome the above technical problems. Contents of the invention [0003] The purpose of the present invention i...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/51H04N23/57H04N23/55H04N23/54H05K1/181H05K2201/09354H05K2201/10121H05K2201/10371H05K1/0216Y02P70/50
Inventor 黄丁男陈家纬陈信文
Owner TRIPLE WIN TECHSHENZHEN CO LTD