Film forming auxiliary device applied to semiconductor equipment of Interent-of-things and using method thereof

Abstract

The invention discloses a film forming auxiliary device applied to semiconductor equipment of Internet-of-things and a using method thereof. The invention belongs to the technical field of internet-of-things semiconductors. According to the equipment and the using method, the temperature of the exchange ball is reduced; heat exchange is indirectly carried out between the forming cavity and the refrigerating cavity; after the temperature is slightly reduced, cold air in the refrigeration cavity is pumped into the spherical air bag through the vertical connecting pipe, the transverse connectingpipe and the corrugated pipe by the air pump; the air enters the film forming device main body through the first air holes; the semiconductor lining is cooled through air cooling; after the temperature is further reduced, the exchange ball moves up and down repeatedly; the hole expanding head is repeatedly contacted with the connecting rod; the semiconductor lining is directly cooled by the cold air through the second air holes, so that the semiconductor can be cooled to different degrees in different stages, the possibility of cracks of the semiconductor due to large temperature difference islow, and the possibility of gaps between the formed outer film and the semiconductor is reduced.

Description

technical field [0001] The present invention relates to the field of Internet of Things semiconductor technology, and more specifically, relates to an auxiliary device for film formation applied to Internet of Things semiconductor equipment and a method for using the same. Background technique [0002] The Internet of Things refers to the real-time collection of any object or process that needs to be monitored, connected, and interacted, and its sound, Various required information such as light, heat, electricity, mechanics, chemistry, biology, and location can be connected through various possible networks to realize the ubiquitous connection between things and things, and between things and people, and realize the intelligence of things and processes Perception, identification and management, the Internet of Things is an information carrier based on the Internet, traditional telecommunication networks, etc., which allows all ordinary physical objects that can be independen...

AI Technical Summary

Problems solved by technology

[0004] At present, in the process of forming a liquid crystal semiconductor film, the target is continuously bombarded by high-speed energetic particles, which will generate high temperature and easily cause damage to the target. Therefore, it is necessary to cool the semiconductor after film formation. In the prior art, it is usually directly After the film is formed, the high-temperature semiconductor is cooled down, so the temperature of the semiconductor will change greatly, which will cause cracks in the semiconductor after film formation, and may cause gaps between the outer film and the semiconductor.

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