Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Small-pitch display module and manufacturing method thereof

A technology for a display module and a manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as open circuit and LED chip damage, and achieve broad application prospects and low production costs. , to avoid the effect of LED chip damage or open circuit

Active Publication Date: 2020-11-06
HCP TECH CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a small-pitch display module and its manufacturing method, which is used to solve the problem that LED chips are easily damaged or disconnected in the lamination process in the prior art.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Small-pitch display module and manufacturing method thereof
  • Small-pitch display module and manufacturing method thereof
  • Small-pitch display module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Such as Figure 1a ~ Figure 3b and Image 6 As shown, this embodiment provides a small-pitch display module. The small-pitch display module includes a PCB substrate 101 , a Mini LED chip 102 , a filling layer 107 and an encapsulation layer 110 .

[0053] Such as Figure 1a and figure 2 As shown, among them, figure 2 shown as Figure 1a The schematic diagram of the cross-sectional structure at AA' in the middle, the PCB substrate 101 includes a first surface and a second surface, the first surface has electrodes for connecting with the Mini LED chip 102, and the second surface has a connecting part , used to connect with the driver chip. There are interconnecting wires inside the PCB substrate 101, which can be a single-layer or multi-layer board, and the electrodes include a first electrode 103 and a second electrode 104, and the first electrode 103 and the second electrode 104 are point electrodes. electrode, the first electrode 103 can be positive or negative, ...

Embodiment 2

[0093] Such as Figure 11 ~ Figure 13 As shown, this embodiment provides a small-pitch display module, the basic structure of which is the same as that of Embodiment 1, wherein the difference from Embodiment 1 lies in: the top of the Mini LED chip 102 and the encapsulation layer 110 There is also a window layer 109 between them, and the top surface of the filling layer 107 may be higher than the top surface of the Mini LED chip 102 and lower than the top surface of the window layer 109 . The material of the window layer 109 includes transparent resin, and the resin includes one of silicone resin and epoxy resin. The window layer 109 partially covers the Mini LED chip, and the shape of the window layer 109 includes one or more combinations of rectangle, triangle, pentagon, trapezoid, circle and ellipse. Corresponding to different Mini LED chips 102, the window layer 109 can be designed in different shapes or sizes, for example, as Figure 12 As shown, the window layer 109 can...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a small-spacing display screen module and a manufacturing method thereof. The small-spacing display screen module comprises a PCB substrate; the Mini LED chip is arranged on thePCB substrate in an inverted manner; the space between the Mini LED chips is filled with the filling layer, and the filling layer is used for preventing light mixing between the Mini LED chips; and the packaging layer covers the filling layer and the Mini LED chip and is used for protecting the Mini LED chip and the filling layer and providing a light scattering effect for the Mini LED chip. Theinvention discloses a small-spacing display screen module manufactured through a bottom filling method. Silicon resin doped with carbon powder is added between Mini LED chips through an underfill method; the ink color background required by the module is provided, so that the display screen has higher ink color consistency. Meanwhile, the phenomena of LED chip damage or open circuit (dead lamp) caused by a film pressing procedure and the subsequent repair problem are avoided, and the manufacturing yield is higher.

Description

technical field [0001] The invention relates to the field of display screen design and manufacture, in particular to a small-pitch display screen module and a manufacturing method thereof. Background technique [0002] With the continuous improvement of indoor display application technology, the currently used display application products such as projection / DLP / LCD / PDP cannot fully meet the market application requirements. There are also some defects in various aspects so that it cannot break through the development of technology. The LED full-color display has overcome many of the defects of the above-mentioned products, and has become the first choice for indoor and outdoor large-screen displays, such as command centers, outdoor advertising screens, conference centers and other occasions. [0003] The production methods of small-pitch display modules are as follows: 1. Discrete device (SMD); 2. 4-in-1 Mini LED (IMD); 3. chip on board (COB). At present, the minimum dot pi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L21/98H01L27/15H01L23/31
CPCH01L23/3114H01L23/3121H01L25/167H01L25/50H01L27/156
Inventor 庄文荣孙明黄志强卢敬权
Owner HCP TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com