A tin nozzle device for cleaning soldering machine and cleaning method
A technology for soldering machine and tin nozzle, which is applied in the direction of tin feeding device, cleaning method and utensils, cleaning method using liquid, etc. It can solve problems such as difficult to clean, can not continue to use, burn damage of tin nozzle, etc., and achieve improvement Cleaning efficiency and the effect of reducing labor costs
Active Publication Date: 2021-05-18
GOERTEK INC
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Problems solved by technology
[0003] However, when soldering with laser spray ball soldering, the tin nozzle will be heated by melting tin during its working process. On the one hand, tin slag will adhere to the inner wall surface of the tin nozzle, which will affect the stability of continuous welding; on the other hand On the one hand, it will cause burn damage to the tin nozzle, and it cannot continue to be used
[0004] In the prior art, when solving the above technical problems, the internal residue of the tin nozzle is usually cleaned manually with hard objects, but the inner diameter of the tin nozzle is small, and it is difficult to clean it manually, which is time-consuming and laborious. The nozzle is a precision part, and the internal structure of the nozzle is often destroyed when the tin slag is processed manually with hard objects;
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[0039] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
[0040] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.
[0041] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.
[0042] In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...
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The invention discloses a tin nozzle device and a cleaning method for cleaning a soldering machine. The device comprises a first tank body and a second tank body, the first tank body and the second tank body are configured to accommodate cleaning liquid; a flushing part, the first tank body and the second tank body pass through the flushing part Communication; the flushing part includes a cleaning chamber and a connecting pipe; the cleaning chamber is configured to accommodate at least one tin nozzle; the cleaning chamber communicates with the first connecting pipe, and one end of the first connecting pipe is connected to The first tank body is connected, and the other end of the first connecting pipe is connected to the second tank body; the auxiliary device is configured to inject the cleaning hydraulic pressure in the first tank body into the second tank body, Then the cleaning solution entering the second tank is pressed into the first tank again. The cleaning device of the present invention improves the cleaning efficiency of the tin nozzle, improves the service life of the tin nozzle, and reduces the production cost.
Description
technical field [0001] The invention relates to the technical field of cleaning devices, in particular to a device for cleaning a tin nozzle of a soldering machine and a cleaning method. Background technique [0002] The laser soldering process has many forms, such as solder paste, solder wire, solder balls, etc. Among them, there is a laser spray ball soldering method in the form of laser solder balls, which has high precision, high tin amount control, and low thermal impact on products or pads. Such advantages are often applied in the field of high-end solder. [0003] However, when soldering with laser spray ball soldering, the tin nozzle will be heated by melting tin during its working process. On the one hand, tin slag will adhere to the inner wall surface of the tin nozzle, which will affect the stability of continuous welding; on the other hand On the one hand, it will cause burn damage to the tin nozzle and cannot continue to be used. [0004] In the prior art, whe...
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IPC IPC(8): B08B3/02B08B13/00B23K1/005B23K3/06
CPCB08B3/02B08B13/00B23K1/0056B23K3/0607
Inventor 鞠广旭林敬刚李婷齐文杰
Owner GOERTEK INC