An integrated circuit copper clad laminate dust removal device
A dust removal device and integrated circuit technology, applied in the direction of dust removal, cleaning methods and tools, chemical instruments and methods, etc., can solve the problems of flying dust everywhere, secondary pollution, low efficiency of manual dust removal, etc.
Active Publication Date: 2021-02-09
中山市宝悦嘉电子有限公司
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Problems solved by technology
The appearance of dent defects on copper foil substrates has always troubled the quality of production, and the manual assembly of copper foil substrates before lamination is very important, especially dust pollution when assembling copper foils. Manual dust removal is generally used, but the efficiency of manual dust removal is low. , and it is easy to cause secondary pollution
[0004] There are also many shortcomings in the above-mentioned patents in use: 1. Copper clad laminates need manual loading
2. Dust is flying everywhere during operation, which is easy to cause secondary pollution
Method used
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[0027]In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0028] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or It should not be construed as limiting the invention by implying that a referenced device or element must have a particular orientation, be ...
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The invention relates to the technical field of dust removal equipment, in particular to a dust removal device for a copper-clad plate of an integrated circuit. The dust removal device comprises a transfer table, a loading mechanism, a first dust removal mechanism, a turnover mechanism, a second dust removal mechanism and an unloading conveyor belt, wherein the loading mechanism, the first dust removal mechanism, the turnover mechanism, the second dust removal mechanism and the unloading conveyor belt are uniformly distributed around the transfer table; the first dust removal structure and thesecond dust removal structure are the same in structure, and each comprises a dust removal cabinet body, a bearing assembly, a sealing assembly and a dust removal assembly, a dust removal space is formed in the dust removal cabinet body, the bearing assembly is mounted in the dust removal space, a discharge window is formed in the outer wall of the dust removal cabinet body, the sealing assemblyis positioned above the discharge window, and the dust removal assembly is positioned above the bearing assembly. The dust removal device realizes automatic dust removal for the copper-clad plate, andprevents flying dust from causing secondary pollution.
Description
technical field [0001] The invention relates to the technical field of dust removal equipment, in particular to a dust removal device for an integrated circuit copper-clad laminate. Background technique [0002] With the rapid development of the electronic technology industry, PCB circuit requirements tend to be refined, dense, and multi-functional, so the requirements for the appearance of the front-end copper clad laminate are getting higher and higher. The appearance of dent defects on copper foil substrates has always troubled the quality of production, and the manual assembly of copper foil substrates before lamination is very important, especially dust pollution when assembling copper foils. Manual dust removal is generally used, but the efficiency of manual dust removal is low. , and it is easy to cause secondary pollution. [0003] The patent No. is CN207981782U, a copper-clad laminate dedusting device, including a mounting table, a connecting rod is welded on the t...
Claims
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IPC IPC(8): B08B5/02B08B15/04B08B13/00
CPCB08B5/02B08B13/00B08B15/04
Inventor 汪浩添
Owner 中山市宝悦嘉电子有限公司