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A bonding device for side bonding of boards

A technology of laminating device and side sticking, which is applied in the directions of lamination device, lamination auxiliary operation, chemical instrument and method, etc. Attachment efficiency and production efficiency, improve attachment firmness, and reduce the effect of attachment process

Active Publication Date: 2022-02-25
合肥泰沃达智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional side sticking method is to cut the side patch to be slightly smaller than the surface of the plate, and directly attach it to the surface of the plate to be bonded manually, which often makes the attachment efficiency low. At the same time, for novices who have not operated In terms of manual attachment, there are often situations such as sticking and sticking skewed, and the probability of rework is relatively high, which affects production efficiency and results in low quality of plate sticking

Method used

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  • A bonding device for side bonding of boards
  • A bonding device for side bonding of boards
  • A bonding device for side bonding of boards

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Embodiment Construction

[0034] In the following, the technical solution of the present invention will be described in detail through specific embodiments, and many specific details are set forth in the following description so as to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0035] refer to Figures 1 to 13 , a bonding device for side bonding of plates proposed by the present invention includes a frame 100, on which is provided a supplying mechanism 1 for providing side bonding, and a pressing mechanism 2 for fixing the side bonding to the surface of the plate to be bonded And the cutting mechanism 3 that cuts off the side stickers of the laminated plates. The fixed end of the pressing mec...

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PUM

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Abstract

The invention discloses a bonding device for side bonding of boards, which comprises a frame. The frame is provided with a bonding mechanism for providing side bonding, a pressing mechanism for fixing the side bonding to the surface of the sheet to be bonded, and an The cutting mechanism for cutting off the side sticking of the plate, the fixed end of the pressing mechanism is slidingly connected with the frame, the pressing end is rollingly connected with the surface of the plate to be pasted through the side sticking, and the cutting mechanism is fixedly connected with the pressing mechanism; The mechanism includes a first rotating shaft and a side sticker with one end wound on the first rotating shaft, the other end of the side sticker is fixed to one end of the surface to be laminated, and the first rotating shaft is rotationally connected with the frame through a bearing seat; Limit stoppers are provided on one side / both sides of the axial direction, and the limit stoppers are slidably connected to the first rotating shaft; this laminating device adopts mechanized attachment, which reduces the chance of rework and improves attachment efficiency and production efficiency.

Description

technical field [0001] The invention relates to the technical field of plate attachment, in particular to a laminating device for side attaching of plates. Background technique [0002] Some membrane materials need to be attached to combine with membrane materials to achieve different functions, for example, attach an insulation layer to the insulation board to improve the insulation effect of the insulation board; attach a reflective sheet to the light guide plate to prevent light leakage wait. [0003] The traditional side sticking method is to cut the side patch to be slightly smaller than the surface of the plate, and directly attach it to the surface of the plate to be bonded manually, which often makes the attachment efficiency low. At the same time, for novices who have not operated In terms of manual attachment, there are often situations such as sticking and skewing, and the probability of rework is relatively high, which affects production efficiency and results i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B38/00
CPCB32B37/10B32B38/0004B32B2307/40B32B2551/00
Inventor 黄顺运覃佐波张亚荣田锋
Owner 合肥泰沃达智能装备有限公司
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