Pressure sensitive element resistant to high-temperature particle scouring, preparation method thereof and sputtering film pressure sensor

A technology of sensitive components and high temperature resistance, applied in the direction of measuring fluid pressure, instruments, measuring devices, etc., can solve the problems of narrow operating temperature range, insufficient temperature shock resistance and life, film bursting, etc., to improve reliability and service life. , strong erosion/impact performance, and the effect of strong erosion/impact capability

Active Publication Date: 2020-03-27
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary pressure sensors are difficult to resist the erosion and impact under such high temperature conditions. For example, the silicon piezoresistive pressure sensor with an isolation diaphragm, the diaphragm is only 0.03mm, and it is easy to deform or break down under the erosion of high temperature particles. The thick film ceramic pressure sensor cannot High temperature resistance; the maximum temperature of the sapphire pressure sensor is 250°C, which cannot meet the high temperature measurement of gas
Obviously, the existing common pressure sensors still have the following problems: (1) cannot be applied to the measurement of high-temperature gas and high-temperature melt; (2) do not have the ability to resist the erosion and impact of solid particles
In addition, the following problems still exist in the pressure sensitive element of the existing sputtered film pressure sensor: SiO 2 As an insulating layer, since SiO 2 The coefficient of thermal expansion is 0.5×10 -6 / K, which has a large difference in thermal expansion coefficient from that of the metal substrate. As a result, the operating temperature range is narrow, and the film on the metal substrate will burst at high temperature, losing the pressure measurement function, that is, the pressure sensitive element fails
The high-temperature alloy is used as the elastic diaphragm in the pressure sensitive element of the existing sputtered thin-film high-temperature pressure sensor. Although this design solves the problem of high-temperature resistance measurement, there is still a problem of thermal expansion coefficient mismatch between the high-temperature alloy and the insulating layer material. As a result, the sputtered film high-temperature pressure sensor still has deficiencies in temperature shock resistance and life; at the same time, the pressure sensitive element in the sputtered film high-temperature pressure sensor is located in the pressurized channel, and the pressure sensitive element is located in the pressurized channel because the pressurized channel is deep. A concave surface with a vertical dead angle is formed between it and the pressurized channel. When the burning solid particles hit the concave surface, it is easy to cause solid particles to accumulate, thereby blocking the pressurized channel. Long-term use will reduce the detection accuracy of the sensor
The existence of the above problems greatly limits the wide application of sputtered thin film pressure sensors

Method used

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  • Pressure sensitive element resistant to high-temperature particle scouring, preparation method thereof and sputtering film pressure sensor
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  • Pressure sensitive element resistant to high-temperature particle scouring, preparation method thereof and sputtering film pressure sensor

Examples

Experimental program
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Embodiment 1

[0043] A pressure sensitive element resistant to high temperature particle erosion, such as figure 1 As shown, it includes an elastic base material 1; the elastic base material 1 is a flaring convex elastic body structure, including a pressurized chamber 10, a body 11 and a mounting part 12; the mounting part 12 is sequentially provided with a transition layer 2, an insulating layer 3, Resistive film layer 4, passivation layer 5, metal layer 6, wherein the elastic base material 1 has a linear expansion coefficient of 6.9×10 at a temperature of -60°C to 600°C -6 / K~8.3×10 -6 / K high temperature alloy, the insulating layer is Al 2 o 3 .

[0044] In this embodiment, the angle θ1 between the top surface and the side surface of the pressurized chamber 10 is 135°, and the depth H1 of the pressurized chamber 10 is 3.25 mm.

[0045] In this embodiment, the elastic base material 1 is 4J33 alloy (commercially available).

[0046] In this embodiment, the transition layer 2 is NiSiAL...

Embodiment 2

[0058] A sputtered thin-film pressure sensor resistant to high-temperature particle erosion, such as figure 2 As shown, it includes a hollow shell and the pressure sensitive element in Example 1.

[0059] In this embodiment, the hollow shell is fixed to the pressure sensitive element through the mounting part 12, and the transition layer 2, the insulating layer 3, the resistive film layer 4, the passivation layer 5 and the metal layer 6 on the mounting part 12 are arranged in the hollow shell Inside the body, the main body 11 is located outside the hollow shell, and the lead wire 7 is drawn out from the inside of the hollow shell, where the mounting part 12 and the hollow shell are fixed by welding (laser welding, argon arc welding or electron beam welding are all acceptable) .

[0060]In this embodiment, the sputtering thin-film pressure sensor resistant to high-temperature particle erosion includes a hollow shell and a pressure-sensitive element. The pressure-sensitive ele...

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Abstract

The invention discloses a pressure sensitive element resistant to high-temperature particle scouring, a preparation method of the pressure sensitive element and a thin film sputtering pressure sensor.The pressure sensitive element comprises an elastic substrate material, is of a flared convex elastomer structure and comprises a pressurizing cavity, a body and a mounting part; and a transition layer, an insulating layer, a resistive film layer, a passivation layer and a metal layer are sequentially arranged on the mounting part. The preparation method of the pressure sensitive element comprises the step of sequentially preparing the transition layer, the insulating layer, the resistive film layer, the passivation layer and the metal layer on the elastic substrate material. The pressure sensitive element provided by the invention has the advantages of good high temperature resistance, strong erosion/impact resistance, long service life, wide application range, good reliability, high strain sensitivity and the like. The preparation method of the pressure sensitive element has the advantages of simple preparation process, convenience in operation, low production cost, short productionperiod and the like, and the pressure sensitive element can be widely used for preparing sputtering film pressure sensors and has high use value and good application prospect.

Description

technical field [0001] The invention belongs to the technical field of pressure sensor preparation, and relates to a pressure sensitive element resistant to high temperature particle erosion, a preparation method thereof, and a sputtering film pressure sensor. Background technique [0002] Sputtered thin film pressure sensor technology is generally limited to use at ordinary temperatures. Different designs meet different application occasions. In some occasions, high-temperature gas is required for pressure measurement, and these high-temperature gases often contain solid particles, which can scour and impact sensitive components at a very fast speed. Ordinary pressure sensors are difficult to resist the erosion and impact under such high temperature conditions. For example, the silicon piezoresistive pressure sensor with an isolation diaphragm, the diaphragm is only 0.03mm, and it is easy to deform or break down under the erosion of high temperature particles. The thick fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/06
CPCG01L19/06
Inventor 金忠刘又清何锋何迎辉蓝镇立
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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