Check patentability & draft patents in minutes with Patsnap Eureka AI!

A dual-mode communication digital transmission chip and a dual-mode communication method

A communication and chip technology, applied in transmission systems, electrical components, etc., can solve problems such as high prices, electronic product costs, high costs for R&D and sales, and dependence on imported chips.

Active Publication Date: 2021-09-14
江苏钜芯集成电路技术股份有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When it comes to communication with Bluetooth peripherals of mobile phones, it relies heavily on imported chips, and the price is high, which undoubtedly occupies a high cost of electronic product costs, research and development, and sales.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A dual-mode communication digital transmission chip and a dual-mode communication method
  • A dual-mode communication digital transmission chip and a dual-mode communication method
  • A dual-mode communication digital transmission chip and a dual-mode communication method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and It is not to indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orie...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a dual-mode communication digital transmission chip and a dual-mode communication method, comprising a packaged chip body and 8 pins arranged on both sides of the packaged chip body and connected to the internal circuit of the packaged chip body, the first The pins are connected to the interrupt command circuit inside the packaged chip body, the second pin is connected to the power supply circuit inside the packaged chip body, the third pin is connected to the radio frequency input and output circuit inside the packaged chip body, and the second pin is connected to the radio frequency input and output circuit inside the packaged chip body. The four pins are connected to the ground terminal inside the packaged chip body, the fifth pin is connected to the crystal oscillator input circuit inside the packaged chip body, and the sixth pin is connected to the data input circuit inside the packaged chip body, The seventh pin is connected to the data output circuit inside the packaged chip body, and the eighth pin is connected to the ground terminal inside the packaged chip body. The invention supports dual-mode communication, only needs 2 to 3 serial port commands to realize simple communication, low cost, rapid development, easy to use and simple.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a dual-mode communication digital transmission chip and a dual-mode communication method. Background technique [0002] The development of radio communication is changing with each passing day. From 433M, 315M to 2.4G and even higher frequencies, the application fields are becoming wider and wider, providing various conveniences for human beings. [0003] When it comes to communication with Bluetooth peripherals of mobile phones, it relies heavily on imported chips, and the price is high, which undoubtedly occupies a high cost of electronic product costs, research and development, and sales. [0004] Traditional bluetooth and radio communication require certain experience to complete the project efficiently. Contents of the invention [0005] The present invention provides a dual-mode communication digital transmission chip and a dual-mode communication meth...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/401
CPCH04B1/401
Inventor 郭培濠黄保黔
Owner 江苏钜芯集成电路技术股份有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com