Instrument for testing an integrated circuit (IC) carrier plate after ball mounting

A technology of integrated circuits and testing instruments, which is applied in the field of testing instruments after ball-planting of integrated circuit IC carriers to achieve the effect of reducing contact area and spacing

Inactive Publication Date: 2020-03-31
SUZHOU KELINYUAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to provide a test instrument after ball planting of an integrated circuit IC carrier, which can solve the problem of solder ball testing of small PCB boards

Method used

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  • Instrument for testing an integrated circuit (IC) carrier plate after ball mounting
  • Instrument for testing an integrated circuit (IC) carrier plate after ball mounting
  • Instrument for testing an integrated circuit (IC) carrier plate after ball mounting

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Embodiment Construction

[0022] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .

[0023] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

[0024] Un...

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Abstract

The invention discloses an instrument for testing an integrated circuit (IC) carrier plate after ball mounting. The instrument comprises a tool structure plate and a probe structure. The probe structure comprises a probe connecting line and a square probe, the probe connecting line is connected with the end part of the square probe, the square probe comprises a square probe main body and a convexedge arranged on the end surface of the square probe main body, the cross section of the square probe main body is rectangular, and the vertical projection area of the square probe main body is greater than that of the convex edge; the jig structure plate comprises an upper structure plate and a lower structure plate; the square needle main body is fixed on the upper structure plate and the lowerstructure plate; the to-be-tested circuit board is provided with a plurality of spherical test contact positions, the jig structure plate and the probe structure are close to the to-be-tested circuitboard, and the protruding edges are in contact with the spherical test contact positions for testing. The square pin bodies are used for testing, the distance between the adjacent square pin bodies isreduced, the contact area of the probes is further reduced, due to the fact that the square pins have guiding performance, it can be guaranteed that the distance between the pin heads is minimized, and the solder ball testing requirement for a smaller PCB is met.

Description

technical field [0001] The invention relates to the field of testing, in particular to a testing instrument after ball planting of an integrated circuit IC carrier board. Background technique [0002] At present, PCB, the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between various components, printed circuit boards must be used. plate. The printed circuit board is composed of an insulating base plate, connecting wires and pads for ass...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2801G01R31/2808
Inventor 赵志刚文东升
Owner SUZHOU KELINYUAN ELECTRONICS CO LTD
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