Ultrasonic cleaning device for wafer cleaning
An ultrasonic cleaning and wafer technology, applied in the direction of using liquid cleaning methods, cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of central position damage, insufficient cleaning strength, damaged wafers, etc., to ensure the sameness , Easy to identify, even cleaning effect
Active Publication Date: 2020-04-10
爱阔特(上海)清洗设备制造有限公司
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Abstract
The invention relates to the technical field of integrated circuits, and discloses an ultrasonic cleaning device for wafer cleaning. The ultrasonic cleaning device includes a cleaning cavity, a driving structure and a moving arm, and the output end of the driving structure penetrates through the cleaning cavity and is fixedly connected to the rotating arm. According to the ultrasonic cleaning device for wafer cleaning, the moving speed of a servo structure gradually increases along with decrease of the distance between the servo structure and the center of a moving table, the decrease in the linear velocity of points near the center position is counteracted, and therefore ultrasonic energy received by each point remains uniform; meanwhile, the ultrasonic area of the device is linear, the movement speed of the servo structure and the rotation speed of the moving table are matched, the surface of an entire wafer can be completely cleaned at a time, due to eccentric rotation of the wafer,the rotation state of the wafer can be calculated through the time wasted by passing of a gap of the wafer through a position sensor; and meanwhile, the position of the wafer can be easily identified, so that the cleaning path can be the same every time to ensure the uniformity of cleaning, and the starting position and the cleaning path can be flexibly designed.
Application Domain
Cleaning using liquids
Technology Topic
PhysicsAsic technology +6
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