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Electrical element transfer apparatus

A technology of electrical components and transmission devices, applied in the direction of electrical components, electrical components, circuits, etc., can solve the problems of high error rate and low transmission speed, and achieve the effect of low error rate and high transmission speed

Active Publication Date: 2020-04-10
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a multi-chip transfer method, an existing method of transferring multiple micro LEDs from a base plate to a display panel using a stamper, tape, or a high-speed mounter can be used, but there may be problems of high process error rate and low transfer speed

Method used

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  • Electrical element transfer apparatus
  • Electrical element transfer apparatus
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Examples

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Embodiment Construction

[0031] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the present disclosure is not limited to specific embodiments, but includes various modifications, equivalents and / or replacements of the embodiments of the present disclosure. With respect to the description of the figures, like reference numerals may be used to refer to like elements.

[0032] In this disclosure, the expressions "have", "may have", "include" and "comprise", or "may include" and "may include" indicate that there are corresponding features (for example, such as numerical values, functions, operations or components). element), and the presence of other features is not excluded.

[0033] In the present disclosure, the expression "A or B", "at least one of A or / and B" or "one or more of A or / and B", etc. may include all possible combinations of the items listed together . For example, "A or B", "at least ...

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PUM

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Abstract

According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

Description

technical field [0001] Various embodiments of the present disclosure relate to conveying devices for electrical components. Background technique [0002] It is a recent trend to replace pixels of displays with electrical components such as miniature light emitting diodes (LEDs). Since long-distance displays (for example, outdoor long-distance displays) use LED packages that are a few millimeters in size, such displays are not suitable for short-distance use or home use. Therefore, in order to realize a short-distance display, the problem of how to accurately transfer LEDs with a size of tens to hundreds of micrometers (μm) corresponding to the current pixels to the board and how to transfer them with high yield should be first solved. The size of one pixel of a home display currently under development is generally about 100 μm, and the size of R / G / B sub-pixels constituting one pixel is only a few tens of microns. [0003] LEDs having a size of several tens of microns corre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H05K13/02H05K13/04
CPCH01L33/0095H01L21/67144H01L21/67333H05K13/0482H01L21/67712H01L21/67721H01L21/67132H05K13/028H05K13/0408H05K13/0409H05K13/041H01L33/005H05K13/02Y10T29/53174
Inventor 张铉太朴民李柄勋李溁澈李昶准张智岭文永俊朴珉莹尹正根崔源张时镐
Owner SAMSUNG ELECTRONICS CO LTD