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Method, device and feedback system of strain measurement and stress optimization, and recording medium

A technology of strain measurement and optimization device, applied in the direction of measurement device, measurement force, instrument, etc., can solve problems such as inability to measure thin films, achieve the effect of optimizing thickness, reducing transmission problems and process problems, and reducing warpage

Inactive Publication Date: 2020-04-14
IND TECH RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method of measurement cannot measur

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  • Method, device and feedback system of strain measurement and stress optimization, and recording medium
  • Method, device and feedback system of strain measurement and stress optimization, and recording medium
  • Method, device and feedback system of strain measurement and stress optimization, and recording medium

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Example Embodiment

[0033] figure 1 It is a schematic diagram of a device for strain measurement and stress optimization of a flexible substrate according to an embodiment of the present invention. The device 100 for strain measurement and stress optimization of a flexible substrate includes a processor 110 and a memory 120. The processor 110 is electrically connected to the memory 120. The memory 120 stores multiple instructions. When the processor 110 executes these instructions, the The strain measurement and stress optimization device 100 is used to implement a method for strain measurement and stress optimization of a flexible substrate. The processor 110 is, for example, a chip, a circuit, a circuit board, or a recording medium storing an array of program codes.

[0034] In an embodiment, the apparatus 100 for strain measurement and stress optimization of the flexible substrate further includes an auto-focus optical microscope 130 that is electrically connected to the processor 110 and the mem...

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Abstract

The invention provides a method, a device and a feedback system for strain measurement and stress optimization, and a recording medium. In one embodiment, the method for strain measurement and stressoptimization of a flexible substrate comprises the steps of respectively obtianing vibration amplitudes of multiple points of the flexible substrate, calculating the strain values of the multiple points of the flexible substrate and converting to stress values; respectively obtaining the vibration amplitudes of the multiple points on a single-layer film formed on each first flexible substrate of multiple first flexible substrate and converting to the strain values; obtaining the vibration amplitudes of multiple points on a multilayer film which is stacked on a second flexible substrate and converting to the strain values; resolving an equation for obtaining a material coefficient of each single-layer film; and when the strain value is set to zero, fixing the thickness of one part of the single-layer films formed on the first flexible substrate, comparing with a corresponding value database, and calculating the thickness of the other part of the single-layer films formed on a to-be-optimized first flexible substrate.

Description

technical field [0001] The disclosure relates to a method, device, feedback system and a computer-readable recording medium for strain measurement and stress optimization of a flexible substrate. Background technique [0002] In the process of depositing organic thin films, flexible substrates such as plastic or extremely thin glass are often used. The problem currently encountered is that depositing a thin film on a substrate easily causes stress in the film, which leads to warpage of the substrate. Substrate warpage can be extremely problematic in line transport for deposition of organic thin films, for example in roll-to-roll processes. [0003] Currently existing stress measurement methods are applied to rigid substrates, such as silicon wafers. The thin film is deposited on the silicon wafer, and the stress value of the thin film is obtained through conversion of the Stoney equation by using a thin film stress measuring instrument. However, this method of measurement...

Claims

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Application Information

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IPC IPC(8): G01B21/32G01L1/00
CPCG01B21/32G01L1/00
Inventor 高浩哲陈信助陈婉心刘玟泓
Owner IND TECH RES INST
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