Heat dissipation structure of pcb circuit board and cooking utensil with same

A technology of PCB circuit board and heat dissipation structure, which is applied in the direction of support structure installation, electrical equipment structural parts, kitchen utensils, etc., can solve the problems of unsatisfactory service life, etc., and achieve the effect of weakening heat transfer, reducing heat, and weakening influence

Active Publication Date: 2022-03-22
GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to at least solve the problem that the PCB circuit board of the existing cooking utensils is in a high-temperature working environment, so that the service life is not ideal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation structure of pcb circuit board and cooking utensil with same
  • Heat dissipation structure of pcb circuit board and cooking utensil with same
  • Heat dissipation structure of pcb circuit board and cooking utensil with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0034] It should be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may also be meant to include the plural forms unless the context clearly dictates otherwise. The terms "comprising", "comprising", "containing" and "having" are inclusive and thus indicate the presence of stated...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention belongs to the field of kitchen appliances, and in particular relates to a heat dissipation structure of a PCB circuit board and a cooking appliance having the same. The heat dissipation structure of the PCB circuit board includes: a base body, the base body is arranged inside the cooking utensil; a mounting plate, the mounting plate includes a board main body and a connecting part, the mounting plate is installed on the base body through the connecting part, and there is a gap between the board main body and the base body Setting: PCB circuit board, the PCB circuit board is arranged on the first side of the board main body, and the first side is the side of the board main body away from the substrate. In the heat dissipation structure of the PCB circuit board of the present invention, the substrate and the main body of the board are separated by air, thereby weakening the heat transfer effect between the substrate and the main body of the board, and there is not only an air isolation layer between the PCB circuit board and the substrate, but also The heat transfer from the substrate to the PCB circuit board is further reduced by the isolation of the mounting board, so as to weaken the influence of the high temperature of the substrate on the PCB circuit board, thereby improving the service life of the PCB circuit board.

Description

technical field [0001] The invention belongs to the field of kitchen appliances, and in particular relates to a heat dissipation structure of a PCB circuit board and a cooking appliance having the same. Background technique [0002] This section provides background information related to the present disclosure only and is not necessarily prior art. [0003] When cooking appliances such as ovens and microwave ovens are working, the whole machine is in a state of high temperature, and high temperature has a great impact on the working life of its internal PCB circuit board. In the face of the above problems, the existing solution is generally to place the PCB circuit board in a position with a slightly lower temperature in the whole machine. However, the PCB circuit board is still affected by high temperature, so that it often works under extreme temperature conditions, even Sometimes it works in a state where the local temperature exceeds the standard. Therefore, the service...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K7/14A47J37/06
CPCH05K7/20136H05K7/20145H05K7/14A47J37/0629
Inventor 郭进黄辉邓雁青陈武忠孙炎军张志艳
Owner GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap