Multi-channel flexible seamless electromagnetic shielding three-dimensional chip TR assembly and packaging method

Abstract

The invention discloses a multi-channel flexible seamless electromagnetic shielding three-dimensional chip TR assembly and a packaging method, and belongs to the technical field of radar electronic microwave integrated antenna chip TR assembly manufacturing. A top of a separation cavity with a special-shaped groove is used to apply a flexible conductor material to the special-shaped groove; the separation cavity is placed in a center of a bottom layer of the multi-channel chip TR assembly to be separated; and a whole body is placed into a bottom layer positioning clamp to be fixed, a top layerof the multi-channel chip TR assembly with a substrate special-shaped groove is placed into a top layer positioning clamp to be fixed, the bottom layer and the top layer of the multi-channel chip TRassembly are oppositely assembled, and the complete multi-channel three-dimensional chip TR assembly is assembled through a seal-capping process. The flexible conductor material is applied to the special-shaped groove of the separation cavity to form a continuous flexible conductor belt which is protruded out of the surface of the separation cavity, a low-stress conductive layer which is tightly attached and does not have a structural gap is formed between the separation cavity of the three-dimensional chip TR assembly and the substrate when the separation cavity of the three-dimensional chipTR assembly and the substrate are relatively pressed and fixed, and electric signal isolation between channels of the three-dimensional chip TR assembly is achieved.

Description

technical field [0001] The invention belongs to the technical field of radar, electronic and microwave integrated antenna chip-type TR component manufacturing, and in particular relates to a three-dimensional chip-type TR component with flexible seamless electromagnetic shielding between multiple channels and a packaging method. Background technique [0002] With the development of modern radar technology towards arrays and multi-units, it is booming in the field of aerospace. The demand for small size, light weight and conformalization of microwave devices in modern radar has become stronger. Due to its small size and high density, multi-channel three-dimensional chip TR components can meet the requirements of conformal microwave integrated tile antennas, etc. Features are moving from the laboratory to mass production, playing an increasingly important role. [0003] The multi-channel three-dimensional chip structure TR module realizes compact three-dimensional interconnec...

AI Technical Summary

Problems solved by technology

Due to the requirements of reliability and airtightness in the aerospace field, a fully enclosed enclosure needs to be designed on the outside. The existence of these two makes it difficult to achieve efficient isolation between channels between the TR component compartment and the substrate: when the gap is too small due to the manufacturing surface Due to the problem of roughness, the position of the convex point will generate a large structural stress due to the forced deformation during compression; during the use of the TR component, the stress concentration point will bear greater stress due to the temperature difference between the switch and the operating environment. Deform or even crack the substrate, resulting in reliability hazards or even component scrapping

When the gap is too large, the isolation between channels is not enough, and the electrical signal interference between channels will seriously affect the realization of component specifications, so the development of advanced flexible and seamless isolation layers is imminent.

Images