Multi-channel flexible seamless electromagnetic shielding three-dimensional chip tr assembly and packaging method

Abstract

The invention discloses a multi-channel flexible seamless electromagnetic shielding three-dimensional chip TR component and a packaging method, belonging to the technical field of radar electronic microwave integrated antenna chip TR component manufacturing. A flexible conductor material is applied to the top of the compartment with special-shaped grooves in the special-shaped slots. The compartment is placed in the center of the bottom layer of the multi-channel chip TR component to be isolated, and it is put into the bottom positioning fixture as a whole to fix it. The top layer of the multi-channel chip TR module is fixed in the top positioning fixture, the bottom layer and the top layer of the multi-channel chip TR module are assembled relative to each other, and it is assembled into a complete multi-channel three-dimensional chip TR module through the capping process. The flexible conductor material is applied on the special-shaped groove of the compartment to form a continuous flexible conductor strip and protrude from the surface of the compartment. When the compartment of the three-dimensional chip TR component is pressed and fastened relative to the substrate, a close fit is formed in the middle without leaving any structure The low-stress conductive layer in the gap realizes the electrical signal isolation between the channels of the three-dimensional chip TR component.

Description

technical field [0001] The invention belongs to the technical field of radar, electronic and microwave integrated antenna chip-type TR component manufacturing, and in particular relates to a three-dimensional chip-type TR component with flexible seamless electromagnetic shielding between multiple channels and a packaging method. Background technique [0002] With the development of modern radar technology towards arrays and multi-units, it is booming in the field of aerospace. The demand for small size, light weight and conformalization of microwave devices in modern radar has become stronger. Due to its small size and high density, multi-channel three-dimensional chip TR components can meet the requirements of conformal microwave integrated tile antennas, etc. Features are moving from the laboratory to mass production, playing an increasingly important role. [0003] The multi-channel three-dimensional chip structure TR module realizes compact three-dimensional interconnec...

AI Technical Summary

Problems solved by technology

Due to the requirements of reliability and airtightness in the aerospace field, a fully enclosed enclosure needs to be designed on the outside. The existence of these two makes it difficult to achieve efficient isolation between channels between the TR component compartment and the substrate: when the gap is too small due to the manufacturing surface Due to the problem of roughness, the position of the convex point will generate a large structural stress due to the forced deformation during compression; during the use of the TR component, the stress concentration point will bear greater stress due to the temperature difference between the switch and the operating environment. Deform or even crack the substrate, resulting in reliability hazards or even component scrapping

When the gap is too large, the isolation between channels is not enough, and the electrical signal interference between channels will seriously affect the realization of component specifications, so the development of advanced flexible and seamless isolation layers is imminent.

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