Chip flexible heat transfer mechanism

Abstract

The invention provides a chip flexible heat transfer mechanism, which is arranged on a chip and a heat conduction pad. The heat transfer mechanism comprises a cold plate and a heat conduction block which are arranged up and down; the cold plate and the heat conduction block are connected through an adjustable bolt; triangular slope areas in multiple directions are symmetrically arranged on the edge, in butt joint with the heat conduction block, of the cold plate with the heat conduction block as the center; an elastic triangular prism sliding mechanism is installed in each triangular slope area; and flexible interconnection with the vertical heat transfer path of the chip is achieved through sliding of the elastic triangular prism sliding mechanisms in the triangular slope areas. The four-side elastic wedge blocks and the sliding mechanism are designed, flexible interconnection of vertical heat transfer paths is achieved, the problem of chip overvoltage or unsmooth heat transfer existing in rigid connection is solved, compared with the heat dissipation performance of previous rigid heat transfer path, the heat dissipation capacity of the flexible heat transfer mechanism with the side length of 20 mm can be improved by 10%-20%, and the module installation and heat dissipation reliability is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment mechanical structures, and relates to a chip flexible heat transfer mechanism. Background technique [0002] The current chip heat dissipation is to eliminate the cold plate processing and module assembly errors through the deformation of the thermal pad. Due to the limited deformation of the thermal pad, there is a phenomenon that the thermal pad is not tightly attached or is too tight to squeeze the chip, resulting in a poor heat transfer path. , there is a risk of the chip overheating. SUMMARY OF THE INVENTION [0003] Purpose of the present invention: The present invention provides a flexible heat transfer mechanism for a chip, in order to solve the problem of poor heat dissipation between the chip and the heat dissipation cold plate due to the limited deformation of the heat conducting pad due to the poor heat dissipation of the chip caused by the heat conducting pad being not ...

AI Technical Summary

Problems solved by technology

[0003] Purpose of the present invention: The present invention provides a chip flexible heat transfer mechanism, in order to solve the problem of poor heat dissipation of the chip caused by the limited deformation of the heat conduction pad and the heat dissipation cold plate due to the insufficient adhesion of the heat conduction pad or the extrusion of the chip too tightly question

Images