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Micromechanical pressure sensor assembly and method for producing micromechanical pressure sensor assembly

A pressure sensor, micro-mechanical technology, applied in the direction of semiconductor/solid-state device parts, mechanical equipment, engine components, etc., to prevent sliding

Pending Publication Date: 2020-04-17
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such miniaturized circuits represent a clear challenge for so-called "secondary packaging", i.e. reprocessing into sensors with fixed possibilities, connections and the like in mobile end devices

Method used

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  • Micromechanical pressure sensor assembly and method for producing micromechanical pressure sensor assembly
  • Micromechanical pressure sensor assembly and method for producing micromechanical pressure sensor assembly
  • Micromechanical pressure sensor assembly and method for producing micromechanical pressure sensor assembly

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Embodiment Construction

[0027] figure 1 A schematic cross-sectional illustration of a micromechanical pressure sensor assembly 100 according to an embodiment is shown. The micromechanical pressure sensor component 100 has a substrate 110 . The substrate 110 may be, for example, a ceramic substrate.

[0028] The substrate 110 may also be an LGA substrate. In other words, the substrate 110 can be figure 1 The surface shown below has a tessellated arrangement of contact surfaces (“lands” in English). Instead of an LGA substrate, the substrate 110 can also be configured as a pin grid array (PGA), which has pins instead of contact surfaces, or as a ball grid array (BGA), which has a ball grid The array has solder beads instead of contact areas. The substrate 110 can also be configured as a ceramic column grid array (CCGA), wherein, in the substrate 110 figure 1 On the underside shown below, columnar solder joints made of strongly leaded solder (as in BGAs) are arranged in the form of a grid.

[...

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Abstract

The invention relates to a micromechanical pressure sensor assembly (100) comprising a substrate (110); a pressure sensor component (120) connected to the substrate (110); and a sleeve structure (130)which is substantially in the shape of a hollow conical frustum, is connected to the substrate (110) and at least laterally surrounds the pressure sensor component (120) and has an opening (140) at aside of the sleeve structure (130) facing away from the substrate (110).

Description

technical field [0001] The invention relates to a micromechanical pressure sensor component and a method for producing the micromechanical pressure sensor component. Background technique [0002] Mechanical pressure sensors are required for a variety of applications. The ever-increasing miniaturization of mobile terminals leads to the need for smaller and smaller pressure sensor components, which advantageously have the smallest possible "footprint" (Fuβabdruck), that is to say require as small a footprint as possible. position and thus be able to be integrated into different mobile terminals as diversely as possible. [0003] Concepts known in the construction and connection technology of micromechanical components, especially micromechanical sensors, use different solutions for "packaging" (in English, "packaging") in order to save as much space as possible without compromising their functionality Place these components securely and securely. [0004] In a so-called "La...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/06G01L19/14H01L23/00
CPCG01L19/0627G01L19/0645G01L19/0654G01L19/142H01L2224/48091H01L2224/33181H01L23/24H01L23/04H01L2224/32225H01L2224/48227H01L2224/73265H01L2224/32145H01L2924/00014H01L2224/45099H01L2924/00F16J15/022G01L19/147
Inventor M·克瑙斯R·屈尔斯U·席勒L·绍丹S·舒勒-瓦特金斯D·豪格
Owner ROBERT BOSCH GMBH
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