High-temperature-resistant mica plate adhesive and preparation method thereof

A mica board and adhesive technology, applied in the directions of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of unsatisfactory heat resistance, and achieve excellent electrical insulation performance, good insulation performance, resistance to high temperature effect

Inactive Publication Date: 2020-04-21
湖北新四海化工股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistan

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1. A high-temperature-resistant mica board adhesive, including component A and component B, wherein component A consists of the following raw materials in parts by weight: 5-60 parts of silicone resin, 1-10 parts of dispersion liquid, coupling 0.1-5 parts of the agent, 20-70 parts of the organic solvent; the following components by weight of component B: 40-90 parts of the organic solvent, 10-60 parts of the curing agent.

Embodiment 2

[0026] Embodiment 2, a kind of heat-resistant mica plate adhesive, comprises A component and B component, wherein the raw material composition of A component is the following parts by weight: 30-40 parts of ladder-type structure silicone resin, 5-40 parts of MQ silicone resin 19 parts, 1-5 parts of nano-silica dispersion liquid, 0.1-2 parts of coupling agent and 40-60 parts of organic solvent; the raw material composition of the following parts by weight of component B: 20-50 parts of curing agent and 50-50 parts of organic solvent 80 servings.

Embodiment 3

[0027] Embodiment 3, a kind of preparation method of heat-resistant mica plate adhesive, step (1): 30-40 parts of ladder-type structure silicone resin, 5-19 parts of MQ silicone resin, nano-silica dispersion liquid 1- Add 5 parts, 0.1-2 parts of coupling agent and 40-60 parts of organic solvent into the reaction vessel, raise the temperature to 80-120 degrees, and reflux for 2-6 hours to obtain component A;

[0028] Step (2): Add 20-50 parts of curing agent and 50-80 parts of organic solvent into the reaction container, mix well, and obtain component B;

[0029] Step (3): Mix components A and B in a ratio of 100:1-3 to obtain a high temperature resistant mica board adhesive.

[0030] In the present invention, wherein the structure of ladder structure silicone resin is: (R 1 SiO 1.5 ) m (R 2 SiO 1.5 ) n ;

[0031] In the formula, m and n are the degree of polymerization, R 1 and R 2 For the same or different H, C 1 -C 4 An alkyl group or an alkoxy group thereof is pr...

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Abstract

The invention discloses a high-temperature-resistant mica plate adhesive which comprises a component A and a component B. The component A is prepared from the following raw materials in parts by weight: 30-40 parts of organic silicon resin with a trapezoidal structure, 5-19 parts of MQ silicon resin, 1-5 parts of a nano silicon dioxide dispersion liquid, 0.1-2 parts of a coupling agent and 40-60 parts of an organic solvent. The component B is prepared from the following raw materials in parts by weight: 20-50 parts of a curing agent and 50-80 parts of an organic solvent. Organic silicon resinis used as matrix resin of the mica plate adhesive, so that compared with epoxy matrix resin used in the prior art, the mica plate adhesive has the advantage that the temperature resistance is higher.The carbon content in the resin structure is low, the smoking phenomenon cannot occur under the high-temperature condition, the insulating property is good, and the strength is high.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a high-temperature-resistant mica board adhesive and a preparation method thereof. Background technique [0002] The high temperature resistant mica board is made by bonding mica paper with glue, heating and pressing. The mica content is about 90%, and the organic silica gel water content is 10%. The high temperature resistant mica board material is mainly used in electric irons, hair dryers, toasters, coffee pots, microwave ovens, electric heaters and other household appliances, as well as industrial frequency furnaces, intermediate frequency furnaces, electric arc furnaces, steelmaking furnaces, mines, etc. Heat furnace, ferroalloy furnace, electrolytic aluminum electrolytic cell, injection molding machine motor insulation, etc. This requires that the mica board material has excellent heat resistance and can work normally at high temperature for a long time. Theref...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J183/05C09J183/06C09J11/04
CPCC08K2201/011C08L2201/08C08L2205/025C09J11/04C09J183/04C08L83/04C08K3/36
Inventor 龚家全邵玲陈华玲姚虎杨帆杨开柱
Owner 湖北新四海化工股份有限公司
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