Photoelectric component package
A technology for optoelectronic components and packages, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as damage to wavelength conversion materials, achieve good barrier properties, and reduce luminous efficiency.
Active Publication Date: 2021-10-22
IND TECH RES INST +1
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Problems solved by technology
However, wavelength conversion materials are easily damaged by heat and / or water and oxygen. How to improve the barrier properties of wavelength conversion materials mounted on optoelectronic components to heat and / or water and oxygen through packaging technology, thereby improving the reliability of optoelectronic component packages and its longevity are the key
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[0037] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.
[0038] Figure 1A to Figure 1G It is a partial cross-sectional schematic diagram of the manufacturing process of the photoelectric component package according to the first embodiment of the present invention. Please refer to Figure 1A Firstly, the substrate 110 is provided, and the substrate 110 can be a hard substrate or a flexible substrate with visible light transmission. For example, the material of the aforementioned hard substrate is glass, wafer or other hard materials, and the aforementioned flexible substrate material is eg polyethylene terephthalate (polyethylene terephthalate, PET), polyamide Imine (polyimide, PI), polycarbonate (polycarbonate, PC), polyamide (polyamide, PA), ...
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Abstract
The invention discloses a photoelectric element packaging body, which includes a substrate, at least one photoelectric element, a first barrier layer, a wavelength conversion layer and a second barrier layer. The photoelectric element is arranged on the substrate. The first barrier layer is configured on the substrate and covers the photoelectric element. The wavelength conversion layer is configured on the first barrier layer. The second barrier layer covers the wavelength conversion layer. The composition of the first barrier layer includes a nitrogen element content greater than 0 at % to 10 at %, an oxygen element content ranging from 50 at % to 70 at %, and a silicon element content ranging from 30 at % to 50 at %.
Description
technical field [0001] The invention relates to a photoelectric element packaging body. Background technique [0002] In recent years, research on wavelength conversion materials (such as quantum dots, etc.) and optoelectronic devices (such as light-emitting devices, etc.) has gradually attracted attention. Wavelength conversion materials have the characteristics of concentrated emission spectrum, wide color gamut and good color saturation. Through the combination of wavelength conversion materials and photoelectric components, it is possible to achieve better full-color display effects. However, wavelength conversion materials are easily damaged by heat and / or water and oxygen. How to improve the barrier properties of wavelength conversion materials mounted on optoelectronic components to heat and / or water and oxygen through packaging technology, thereby improving the reliability of optoelectronic component packages And its lifespan is really the key. Contents of the inv...
Claims
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IPC IPC(8): H01L33/54H01L33/56H01L33/50
CPCH01L33/507H01L33/54H01L33/56H01L33/46H01L33/50H01L33/641H01L33/60H01L2933/0041H01L2933/005H01L2933/0058
Inventor 郭燕静洪健彰廖贞慧黄奕翔叶树棠戴宏明陈鸿毅
Owner IND TECH RES INST