MEMS piezoelectric ultrasonic transducer with horn structure

A piezoelectric ultrasonic and transducer technology, which is applied in the direction of fluid using vibration, can solve the problem of sound wave waste and other problems, and achieve the effect of improving energy conversion efficiency and electroacoustic conversion efficiency

Active Publication Date: 2020-04-24
武汉敏声新技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the pMUT vibrates, it generates sound waves with opposite phases at the top and back simultaneously, but in a traditional PMUT, only half of the sound waves are utilized, and the sound waves generated by the back are wasted

Method used

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  • MEMS piezoelectric ultrasonic transducer with horn structure
  • MEMS piezoelectric ultrasonic transducer with horn structure
  • MEMS piezoelectric ultrasonic transducer with horn structure

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Embodiment Construction

[0040] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0041] This embodiment is achieved through the following technical solutions, a MEMS piezoelectric ultrasonic transducer with a horn structure, including a MEMS piezoelectric ultrasonic transducer and a horn-shaped silicon structure, and the horn-shaped silicon structure can be bonded to The upper or lower surface of the MEMS piezoelectric ultrasonic transducer, the cavity in the horn-shaped silicon structure forms at least one acoustic waveguide, and each acoustic waveguide has at least two steps. When the acoustic waveguide has three steps, the first It consists of a stepped sound tube, a second stepped sound tube, and a third stepped sound tube; the cross-sectional area of ​​the first stepped sound tube, the second stepped sound tube, and the third stepped sound tube gradually increases to form a horn-like cavity, which is similar to a horn The shap...

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Abstract

The invention relates to an MEMS ultrasonic transducer technology, and in particular to an MEMS piezoelectric ultrasonic transducer with a horn structure. The transducer comprises an MEMS piezoelectric ultrasonic transducer and a horn-shaped silicon structure, wherein the horn-shaped silicon structure is bonded on the upper surface or the lower surface of the MEMS piezoelectric ultrasonic transducer. A cavity in the horn-shaped silicon structure forms at least one sound wave guide pipe. Each sound wave guide pipe comprises at least two steps. Each step comprises a step sound pipe. The sectional area of each step sound pipe is gradually increased to form a horn-shaped cavity. Each horn-shaped cavity can amplify sound waves generated by the MEMS piezoelectric ultrasonic transducer. In addition, sound waves generated by the back of the MEMS piezoelectric ultrasonic transducer can be conducted to the top of the MEMS piezoelectric ultrasonic transducer and are overlapped with sound waves generated by the top of the MEMS piezoelectric ultrasonic transducer for transmission, so that the intensity of the sound waves generated by the ultrasonic transducer is further improved. According to the device, the intensity of the sound waves generated by the MEMS ultrasonic transducer can be enhanced, and the energy conversion efficiency of the MEMS piezoelectric ultrasonic transducer is improved.

Description

technical field [0001] The invention belongs to the technical field of MEMS ultrasonic transducers, in particular to a MEMS piezoelectric ultrasonic transducer with a horn structure. Background technique [0002] An ultrasonic transducer is a transducing element that can be used to both transmit and receive ultrasonic waves. When working in the transmitting mode, the electric energy is converted into the vibration of the transducer through electrostatic force or inverse piezoelectric effect to radiate sound waves; when working in the receiving mode, the sound pressure acts on the surface of the transducer to vibrate, and the transducer The vibration is then converted into an electrical signal. At present, the most widely used ultrasonic sensors are mainly based on bulk piezoelectric transducers, which mainly use the thickness vibration mode of piezoelectric ceramics to generate ultrasonic waves. Since the resonance frequency of the thickness mode is only related to the thic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/06
CPCB06B1/06
Inventor 孙成亮吴志鹏朱伟王磊胡博豪林炳辉占惠花
Owner 武汉敏声新技术有限公司
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