Graphite-graphene-metal composite material preparation method

A metal composite material and graphene composite technology, applied in the direction of metal/alloy conductors, conductive materials, conductive materials, etc., can solve the problems of thermal conductivity and electrical conductivity that cannot be maintained at a high level at the same time, and achieve suitable large-scale promotion and tight integration , Improving the effect of morphology regulation Chengdu

Active Publication Date: 2020-04-28
SICHUAN LEFEI OPTOELECTRONICS TECH CO LTD
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Problems solved by technology

[0006] Aiming at the above defects or improvement needs of the prior art, the present invention provides a graphite-graphene-metal composite material with high thermal conductivity and high electrical conductivity. Influenced heat conduction and conduction channels, thereby improving the heat conduction and conduction properties of the material at the same time, thereby solving the technical problem that the heat conduction and conduction properties of the prior art cannot be maintained at a high level at the same time

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preparation example Construction

[0029] The invention provides a kind of preparation method of graphite-graphene-metal composite material, comprises the following steps:

[0030] (1) Prepare copper-graphene composite layer: deposit graphene on the copper foil, and stack the copper foil deposited with the graphene layer in multiple layers to form the copper-graphene composite layer; The thickness of the copper-graphene composite layer is 1 mm to 8 mm, preferably 1 mm to 3 mm; the thickness of the copper foil is 20 μm to 30 μm, and the multilayer is preferably 40-350 layers, preferably 40 layers to 120 layers.

[0031] (2) Preparation of copper-graphite composite layer: the copper-plated graphite sheet and copper powder are evenly mixed and paved, preferably pre-sintered after paving to form the copper-graphite composite layer; its thickness is between 1mm and 10mm, Preferably 1mm to 3mm; the surface coating thickness of the copper-plated graphite powder is 0.1 μm to 0.3 μm; the average diameter of the copper-p...

Embodiment 1

[0038] Preparation of a High Thermal Conductivity and High Conductivity Composite Material

[0039] Step 1: Put the copper foil into the chemical vapor deposition equipment, vacuumize it, heat it to 1000°C, then pass in methane 40sccm, argon 400sccm, hydrogen 60sccm, keep warm for 5min, and quickly pull the copper foil from the heating area to the low temperature area Cooling is performed to obtain a single-layer copper-graphene laminate.

[0040] The second step: Repeat the first step to obtain multiple pieces of copper foil with graphene compounded on the surface. 120 sheets of the copper foil compounded with graphene were stacked to obtain a multilayer copper-graphene laminate (1), with a thickness of 3mm.

[0041] Step 3: Take flake graphite powder with an average diameter of 500 μm. First soak graphite powder in 200g / L NaOH solution for 40min to degrease, then wash with water until neutral; then use 20% (volume ratio of concentrated nitric acid to water: 1:4) HNO. The ...

Embodiment 2

[0047] Preparation of a High Thermal Conductivity and High Conductivity Composite Material

[0048] Step 1: Put the copper foil into the chemical vapor deposition equipment, vacuumize it, heat it to 1000°C, then pass in methane 40sccm, argon 400sccm, hydrogen 60sccm, keep warm for 5min, and quickly pull the copper foil from the heating area to the low temperature area Cooling is performed to obtain a single-layer copper-graphene laminate.

[0049] The second step: Repeat the first step to obtain multiple pieces of copper foil with graphene compounded on the surface. 120 sheets of the copper foil compounded with graphene were stacked to obtain a multilayer copper-graphene laminate (1), with a thickness of 3mm.

[0050] Step 3: Take flake graphite powder with an average diameter of 500 μm. First soak graphite powder in 200g / L NaOH solution for 40min to degrease, then wash with water until neutral; then use 20% (volume ratio of concentrated nitric acid to water: 1:4) HNO. The ...

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Abstract

The invention discloses a graphite-graphene-metal composite material preparation method which comprises the steps of (1) depositing graphene on a coper foil, superimposing multiple layers of copper foils deposited with graphene layers together, and forming a copper-graphene composite layer, wherein the thickness of the copper-graphene composite layer ranges from 1mm to 8mm; (2) preparing a copper-graphite composite layer: uniformly mixing a copper-plated graphite sheet and copper powder, and spreading out to form the copper-graphite composite layer, wherein the thickness ranges from 1mm to 10mm; and (3) alternately stacking the copper-graphene composite layer and the copper-graphite composite layer, and hot-pressed sintering to form a graphite-graphene-metal composite material provided bythe invention. According to the graphite-graphene-metal composite material preparation method provided by the invention, through superimposing and compounding the structure layers with excellent heat-conducting property and electricity-conducting property, a structured anisotropic material with a heat-conducting channel and an electricity-conducting channel which do not influence each other is formed; and meanwhile, due to the same metal matrix, the structure layers are combined tightly, the overall mechanical property and the processability are favorable, and the composite material as a whole shows excellent heat-conducting property and electricity-conducting property and can meet the demand of modern electronic industrialization.

Description

technical field [0001] The invention belongs to the field of metal matrix composite materials, and more specifically relates to a preparation method of graphite-graphene-metal composite materials. Background technique [0002] As electronic devices and products become more and more highly integrated and high-computing, energy consumption and power are doubled accordingly. Therefore, heat dissipation has become a key factor restricting the high reliability, normal operation and service life of electronic components. The need for highly integrated heat dissipation in the industry, a new type of composite graphite film with high thermal conductivity and electrical conductivity that is soft, lightweight and high-strength has become an urgent need for heat dissipation of high-integration, high-power, high-performance electronic components. [0003] At present, high thermal conductivity and high electrical conductivity are generally separated to improve performance. For example, g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/04B22F3/14H01B1/02H01B1/04H01B5/00H01B13/00H05K7/20
CPCB22F3/14B22F7/04B22F2007/042H01B1/026H01B1/04H01B5/00H01B13/0026H05K7/2039
Inventor 蒋芳白华蒋鼎陈礼庚熊良明罗杰
Owner SICHUAN LEFEI OPTOELECTRONICS TECH CO LTD
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