Cleaning tool and method for JLCC image sensor circuit before packaging
A technology for image sensor and circuit encapsulation, which is applied in the direction of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., can solve problems such as chip surface damage, achieve efficient cleaning, reduce wear, and have good versatility.
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[0036] The present invention will be further elaborated below in conjunction with embodiment.
[0037] figure 1 It is a schematic diagram of the appearance structure of the JLCC image sensor circuit, figure 2 It is a schematic diagram of the combined structure of the cleaning tool. The tooling and method for cleaning JLCC image sensors before packaging are specially used for cleaning image sensor chips with complex surface structures and damages. It consists of a high-speed rotating platform 1, a circuit positioning tool 2, a two-fluid nozzle 3, and a channel 4 for liquid and high-pressure gas. Such as image 3 As shown, small holes 5 are closely distributed in the center of the high-speed rotating platform 1, and four safety limit card slots 6 are evenly distributed on the edge of the high-speed rotating platform; see image 3 shown. The small holes on the high-speed rotating platform are used to connect the vacuum, and are used to absorb and fix the circuit positioning...
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