Cleaning tool and method for JLCC image sensor circuit before packaging

A technology for image sensor and circuit encapsulation, which is applied in the direction of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., can solve problems such as chip surface damage, achieve efficient cleaning, reduce wear, and have good versatility.

Active Publication Date: 2020-04-28
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can effectively remove particulate contamination, it is easy to cause damage to the chip surface

Method used

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  • Cleaning tool and method for JLCC image sensor circuit before packaging
  • Cleaning tool and method for JLCC image sensor circuit before packaging
  • Cleaning tool and method for JLCC image sensor circuit before packaging

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Experimental program
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Embodiment Construction

[0036] The present invention will be further elaborated below in conjunction with embodiment.

[0037] figure 1 It is a schematic diagram of the appearance structure of the JLCC image sensor circuit, figure 2 It is a schematic diagram of the combined structure of the cleaning tool. The tooling and method for cleaning JLCC image sensors before packaging are specially used for cleaning image sensor chips with complex surface structures and damages. It consists of a high-speed rotating platform 1, a circuit positioning tool 2, a two-fluid nozzle 3, and a channel 4 for liquid and high-pressure gas. Such as image 3 As shown, small holes 5 are closely distributed in the center of the high-speed rotating platform 1, and four safety limit card slots 6 are evenly distributed on the edge of the high-speed rotating platform; see image 3 shown. The small holes on the high-speed rotating platform are used to connect the vacuum, and are used to absorb and fix the circuit positioning...

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Abstract

The invention relates to a cleaning tool and method for a JLCC image sensor circuit before packaging. According to the tool, small holes are closely distributed at the central position of a high-speedrotating platform; four safety limiting clamping grooves are uniformly distributed at the edge of the high-speed rotating platform; a circuit positioning tool comprises a substrate and a plurality ofgroups of circuit limiting clamping grooves formed in the substrate; the plurality of groups of the circuit limiting clamping grooves are located on the same circumference; each group of circuit limiting clamping grooves is used for fixing a to-be-cleaned circuit; the circuit positioning tool is installed on the rotating platform; the circuit positioning tool and the rotating platform are fixed in a vacuum adsorption mode through the small holes formed in the rotating platform; the rotating platform drives the to-be-cleaned circuit on the circuit positioning tool to rotate in a cleaning process; a liquid and high-pressure gas channel is communicated with a two-fluid nozzle placed above the rotating platform; two fluids are sprayed to the surface of the to-be-cleaned circuit through the two-fluid nozzle to achieve cleaning.

Description

technical field [0001] The invention relates to a method for cleaning and transferring a JLCC image sensor circuit before packaging, and belongs to the field of image sensor packaging in a JLCC packaging form. Background technique [0002] Compared with ordinary integrated circuits, the JLCC image sensor circuit has a special structure. The surface of the internal image sensor chip is densely covered with micron-scale pixels. The external structure is composed of a transparent material light window and a JLCC shell cavity. Therefore, the image sensor chip must be attached It is installed inside the open housing cavity, and then the transparent material light window is installed in the opening of the housing cavity to form a seal. Therefore, after the image sensor chip is mounted and before the transparent material is installed to seal the light window, the image sensor is exposed to the production environment, and it is impossible to completely prevent the surface of the ima...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B08B3/02
CPCH01L21/67051B08B3/022B08B3/024
Inventor 冯小成荆林晓李洪剑李峰井立鹏
Owner BEIJING MXTRONICS CORP
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