A packaging method for densely arranging semiconductor chips for Internet of Things terminals
An IoT terminal and packaging method technology, which is applied to semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., can solve the problems of chip pulling, chip damage, and easy torn chips at the connection between the chip and the pin. , to achieve the effect of good fixing effect and simple structure
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[0044] see Figure 1-7 , a packaging method for densely arranging semiconductor chips for Internet of Things terminals, including a lower housing 1, see figure 1 , the upper surface of the lower casing 1 is provided with a placement groove 5, and the upper surface of the lower casing 1 is fixedly connected with two sets of conductive columns 2, and the two sets of conductive columns 2 are respectively located on both sides of the placement groove 5, and the lower casing 1 There is a perforation 3 inside, the shape of the perforation 3 is L-shaped, and the lower opening of the perforation 3 is filled with insulating glue 15, because there is a corner on the L-shaped perforation 3, so that when the leaked pin 4 is involved At this time, the hole wall at the corner can play a counterweight role to prevent the conductive column 2 from being affected, the insulating glue 15 plays the role of insulation, and also plays the role of sealing, and the perforation 3 is located below the ...
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