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Optical transceiver and manufacturing method thereof

An optical transceiver and optical technology, applied in optics, semiconductor/solid-state device manufacturing, optical components, etc., can solve the problems of complex manufacturing process and increased yield of optical transceiver modules

Active Publication Date: 2022-03-15
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Currently, the manufacturing process of optical transceiver modules is very complex and its yield increase is necessary

Method used

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  • Optical transceiver and manufacturing method thereof
  • Optical transceiver and manufacturing method thereof
  • Optical transceiver and manufacturing method thereof

Examples

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Embodiment Construction

[0042] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include that additional features may be formed between the first feature and the second feature. An embodiment is formed between the second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embo...

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Abstract

The present disclosure provides an optical transceiver, including a photonic integrated circuit component, an electronic integrated circuit component, and an insulating sealing body. The photonic integrated circuit assembly includes at least one optical input / output section and at least one recess positioned adjacent the at least one optical input / output section. The electronic integrated circuit assembly is disposed on the photonic integrated circuit assembly and electrically connected to the photonic integrated circuit assembly. The insulating seal is disposed on the photonic integrated circuit assembly and laterally encloses the electronic integrated circuit assembly. At least one recess of the photonic integrated circuit assembly is exposed by the insulating seal and is suitable for insertion of a photonic device.

Description

technical field [0001] Embodiments of the present invention relate to an optical transceiver and a manufacturing method thereof. Background technique [0002] Optical transceiver modules are used in high-speed optical communication systems that require high performance, compact packaging, and low power consumption. Optical transmit / receive functions are implemented in pluggable optical transceiver modules. Optical transceiver modules comply with various international standard specifications at communication speeds up to greater than 100Gbps. Currently, the manufacturing process of optical transceiver modules is very complicated and its yield increase is necessary. Contents of the invention [0003] According to an embodiment of the present invention, an optical transceiver includes a photonic integrated circuit component, an electronic integrated circuit component, and an insulating sealing body. The photonic integrated circuit assembly includes at least one optical inp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4201G02B6/4244G02B6/4274H01L21/56H01L21/561H01L21/6835H01L21/6836H01L2221/68327H01L2221/6834H01L23/3107G02B6/4249G02B6/423H01L2224/73204H01L2224/81815H01L2924/18161H01L24/16H01L24/32H01L24/73H01L2224/13147H01L2224/16227H01L25/18H01L25/50H01L2924/00014G02B6/12G02B2006/12197H01L2924/14H01L24/10
Inventor 陈志豪高金福郑礼辉卢思维
Owner TAIWAN SEMICON MFG CO LTD