A thimble device for chip packaging

Abstract

The invention discloses a thimble device for chip packaging, which comprises a needle barrel, a base and a thimble seat module, the needle barrel is sleeved on the outside of the thimble seat module, and the base is located on the thimble seat module and is used to fix the thimble seat module; the thimble seat module includes a knob unit and a support unit, the top of the support unit is provided with a detachable thimble, and the knob unit is sleeved on the support unit and turn the knob unit, the support unit moves vertically up and down; the upper surface of the syringe is provided with a vacuum hole and a thimble hole corresponding to the thimble. By adjusting the knob unit, it can act on the corresponding support unit, so as to meet the requirements of the number and position of thimbles required by different products, reduce the occurrence of metal foreign objects, and improve the efficiency of staff replacing products.

Description

Technical field [0001] The present invention relates to the field of chip packaging, and in particular, to a top needle device for a chip package. Background technique [0002] At this stage, the pick-up of the chip is mainly carried out by the suction, the blue film, and the top needle mechanism. The chip is distributed on a movable blue film. After the current chip is picked up, the blue film is moved, so that the next chip is above the top needle, and the next pick is performed. The thimble mechanism is located below the blue film, and the chip can be taken out from the wafer after the cutting, and is picked up in the nozzle located above the blue film disc. [0003] In the chip binding machine, since the chip length of each product is different, the number of threads need to be different and the mounting hole position of the thimble is also different. If the product is replaced, it is often necessary to disassemble the syringe, replace the thread, and then adjust the needle t...

AI Technical Summary

Problems solved by technology

[0004] However, when changing the product, human operation is usually required. When the engineer disassembles the syringe and adjusts the thimble, it is very easy to have installation deviation or produce metal foreign objects, which will lead to product abnormalities.

Moreover, due to frequent product replacement operations, in order to adapt to different chips, the work efficiency of the thimble mechanism is greatly reduced.

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