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Redistribution-layer fanout package stiffener

A reinforcement and redistribution layer technology, applied in the field of redistribution layer fan-out packaging, can solve problems such as reducing the productivity of functional packaging devices

Inactive Publication Date: 2020-05-08
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, typical redistribution layers can still have weak points between attached devices
These vulnerabilities can reduce the productivity of functionally packaged devices

Method used

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  • Redistribution-layer fanout package stiffener
  • Redistribution-layer fanout package stiffener
  • Redistribution-layer fanout package stiffener

Examples

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Embodiment Construction

[0014] In this disclosure, numerous specific details are discussed in order to provide a thorough and favorable description of embodiments of the invention. One skilled in the art will recognize that the invention may be practiced without one or more of the specific details. Well-known structures and / or operations typically associated with semiconductor devices may not be shown and / or described in detail so as not to obscure other aspects of the present invention. In general, it should be understood that various other devices, systems and / or methods other than the specific embodiments disclosed herein may be within the scope of the invention.

[0015] The term "semiconductor device assembly" may refer to an assembly of one or more semiconductor devices, semiconductor device packages, and / or substrates, which may include interposers, supports, and / or other suitable substrates. Semiconductor device assemblies can be manufactured in, but not limited to, discrete package form, st...

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PUM

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Abstract

The invention relates to a redistribution-layer fanout package stiffener. An apparatus may include a packaging substrate. The apparatus may further include multiple semiconductor devices attached to the packaging substrate, the multiple semiconductor devices defining a path along the packaging substrate between a pair of the multiple semiconductor devices. The apparatus may also include a stiffener structure coupled to the packaging substrate and positioned with a longitudinal axis of the stiffener structure being perpendicular to the path.

Description

technical field [0001] The present invention relates generally to RDL fan-out packages, and more particularly to stiffeners for stiffening RDL fan-out packages. Background technique [0002] Packaging semiconductor devices together brings many benefits to streamlining the manufacture of computer processors, memory and products. In the packaging process, individual semiconductor devices are formed and then coupled with other semiconductor devices to form a system. A packaging substrate can be used to couple devices to each other. The packaging substrate may include a fan-out layer that expands the size of connections from the semiconductor device to enable connection to larger computing systems. In a typical fan-out packaging assembly, metal layers route device connections on a first side of the redistribution layer to connections on a second side of the redistribution layer. [0003] During and after manufacture, the packaged device may be subjected to force or pressure w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498
CPCH01L23/49816H01L23/49838H01L2224/16225H01L23/5386H01L23/562H01L25/0655H01L23/16H01L23/49827H01L25/50H01L23/49866
Inventor 林景程
Owner MICRON TECH INC