Batch transfer method of micro-elements

Abstract

The invention discloses a batch transfer method of micro-elements. The method comprises the following steps: providing the micro-elements and a first transfer substrate, arranging the micro-elements on a supply substrate, and enabling a first surface of the first transfer substrate to have viscosity; bonding the first transfer substrate to the supply substrate to bond a first surface of the firsttransfer substrate to first surfaces of the micro-elements; removing the supply substrate to expose second surfaces of the micro-elements; providing a second transfer substrate, attaching the second transfer substrate to the first transfer substrate such that a first surface of the second transfer substrate is made to be bonded with the second surfaces of the micro-elements; removing the first transfer substrate to expose the first surfaces of the micro-elements; and providing a target substrate, aligning and fitting the target substrate with the second transfer substrate, and transferring themicro-elements to the target substrate. By means of the mode, transfer equipment can be simplified, the transfer process difficulty is reduced, and the transfer efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a batch transfer method for micro components. Background technique [0002] In recent years, the semiconductor lighting technology has become more mature, the cost has been declining, and the industrial scale has become saturated, which provides a better light source for the development of LED display technology. Micro-LED display technology has the advantages of high brightness, high response speed, low power consumption, and long life, and has become a research hotspot for people pursuing a new generation of display technology. [0003] At present, it is difficult for Micro-LEDs to grow directly on glass substrates. It is necessary to rely on transfer technology to transfer Micro-LEDs grown on other substrates to glass substrates. In view of the tiny size, large growth density and huge transfer quantity of Micro-LED, it is generally necessary to use ultra-high-precision...

AI Technical Summary

Problems solved by technology

In view of the tiny size, large growth density and huge transfer quantity of Micro-LED, it is generally necessary to use ultra-high-precision transfer equipment and transfer heads, which brings great difficulties and challenges to transfer equipment and transfer technology

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