Sound module and electronic equipment
A technology of electronic equipment and sound module, which is applied in piezoelectric/electrostrictive transducer microphones, fixing/tightening of diaphragms, etc., can solve the problem of concentrated sound, feedback, no sound cavity design, and effective occupation of vibration elements. Vibration area and other issues, to achieve the effect of fully undulating spacing and good sound quality
Active Publication Date: 2021-12-07
BYD CO LTD
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Problems solved by technology
[0004] The above scheme mainly has the following defects: 1. The piezoelectric ceramic sounding element is directly bonded to the vibrating element, which occupies a large amount of effective vibration area of the vibrating element and affects the sound quality; Small, and not suitable for small sound-generating appliances such as mobile phone receivers and earphones, and cannot produce good sound; 3. There is no sound cavity design, which affects the concentrated sound and feedback, and affects the sound quality
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[0051] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.
[0052] The present disclosure provides a sounding module and electronic equipment with the sounding module. Such as Figure 1 to Figure 4 As shown, the electronic device 100 includes a device body and a sound module 20 . The shell 10 of the device body is provided with a through hole 121 , and the sound module 20 includes a piezoelectric ceramic 22 , an auxiliary vibration plate 23 , a vibration guide 24 and a diaphragm 25 . The diaphragm 25 is disposed at the through hole 121 , the center of the diaphragm 25 can be aligned with the center of the through hole 121 , and the peripheral edge of the diaphragm 25 can be connected with the casing 10 . The piezoe...
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The present disclosure relates to an electronic device, comprising: a device body, a through hole is arranged on the shell of the device body; The modulus is smaller than the elastic modulus of the piezoelectric ceramic, the piezoelectric ceramic is connected to the auxiliary vibration plate, the auxiliary vibration plate is connected to the diaphragm through the vibration guide, and the vibration film is driven by the auxiliary vibration plate to produce sound, wherein the diaphragm is set in the through At the hole, the outer peripheral edge of the diaphragm is bonded to the shell, the piezoelectric ceramics, the auxiliary vibration plate and the vibration guide are all located in the shell, and the auxiliary vibration plate is connected to the shell. In this disclosure, the piezoelectric ceramics are installed on the auxiliary vibration plate and the auxiliary vibration plate is connected to the housing. When the piezoelectric ceramics vibrates, the auxiliary vibration plate will also vibrate. Since the elastic modulus of the auxiliary vibration plate is small, Therefore, the auxiliary vibration plate can generate a larger amplitude, and the vibration of the auxiliary vibration plate is transmitted to the diaphragm through the vibration guide, so that the undulating spacing of the diaphragm is fully in place, thereby obtaining better sound quality.
Description
technical field [0001] The disclosure relates to a sounding module and electronic equipment with the same. Background technique [0002] As an important part of electronic equipment, the earpiece converts electrical signals into mechanical energy, thereby generating sound through vibration, and is one of the indispensable structures of electronic equipment. [0003] The patent document with the notification number CN206559644U discloses a piezoelectric ceramic sounding module and electronic equipment. On the reserved through hole, the working mode is that the working vibration of the piezoelectric ceramic sounding element drives the vibrating element to vibrate and emit sound. [0004] The above scheme mainly has the following defects: 1. The piezoelectric ceramic sounding element is directly bonded to the vibrating element, which occupies a large amount of effective vibration area of the vibrating element and affects the sound quality; It is small, and it is not suitabl...
Claims
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IPC IPC(8): H04R7/16H04R17/02
CPCH04R7/16H04R17/02
Inventor 刘文展孙亚轩赵永吉赵波
Owner BYD CO LTD